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IC资料

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IC封装资料_电容_CL10B102KB8WPNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB8WPNL●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-121553269.04 KB3页119
IC封装资料_非易失性存储器_N25Q128A13BF840F.pdf
February2010Rev1.01/1851N25Q128128-Mbit,1.8V,multipleI/O,4-Kbytesubsectoreraseonbootsectors,XiPenabled,serialflashmemorywith108MHz...
2024-12-128495.82 MB185页226
IC封装资料_电容_0805B512K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210021.05 MB27页166
IC封装资料_电感_SWPA252012S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212031.32 MB22页289
IC封装资料_电容_GRM1555C1H241JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121765920.26 KB29页197
IC封装资料_电源管理芯片_LTC4357HMS8_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-121565840.98 KB14页288
IC封装资料_电容_GRM1555C1H240JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121333920.26 KB29页231
IC封装资料_电容_GRM155R61C105KA12D.pdf
GRM155R61C105KA12_(0402,X5R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12392920.85 KB29页267
IC封装资料_电容_CL10C681JB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12136259.58 KB3页79
IC封装资料_电容_CL10C681JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12650316.29 KB3页270
IC封装资料_电容_CL10B102KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121328452.9 KB21页102
IC封装资料_电容_CL10C681FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121348259.58 KB3页166
IC封装资料_电容_CL10C680JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121593259.58 KB3页80
IC封装资料_电容_0805B561K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1212081.26 MB20页53
IC封装资料_电容_C1608C0G1H682J080AA.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129821.67 MB57页48
IC封装资料_电感_SWPA252012SR68NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-12631.32 MB22页49
IC封装资料_连接器_1827884.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1238536.13 MB445页36
IC封装资料_电感_SWPA252012S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127381.32 MB22页136
IC封装资料_电容_CL10B102KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB85PNL●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1214825.87 MB36页93
IC封装资料_电源管理芯片_LTC4357IDCB_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-12182840.98 KB14页121

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