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IC资料

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IC封装资料_电容_CL10B181KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B181KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121876361.13 KB3页277
IC封装资料_电容_CL10B154KP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B154KP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216111.45 MB36页174
IC封装资料_连接器_1843635.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/5-G-3,5OrderNo.:184363...
2024-12-12649306.23 KB5页63
IC封装资料_电容_0805F106M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216281.05 MB27页132
IC封装资料_连接器_1843800.pdf
https://www.phoenixcontact.com/us/produkte/184380021.12.2012Page1/7Basestrip-MC1,5/3-GF-3,5-1843800Pleasebeinformedthatthedatashow...
2024-12-121915272.02 KB7页41
IC封装资料_电感_YNR5040-221M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12341666.66 KB5页159
IC封装资料_连接器_1843745.pdf
https://www.phoenixcontact.com/us/produkte/184374502.11.2012Page1/5Basestrip-MCV1,5/16-G-3,5-1843745Pleasebeinformedthatthedatasho...
2024-12-121510175.27 KB5页283
IC封装资料_连接器_1843732.pdf
https://www.phoenixcontact.com/pi/products/184373204/09/2019Page1/4Printed-circuitboardconnector-MCV1,5/15-G-3,5-1843732Pleasebein...
2024-12-121658215.21 KB4页299
IC封装资料_电感_YNR5040-220M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12763666.66 KB5页118
IC封装资料_连接器_1843716.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar19,2010ExtractfromtheonlinecatalogMCV1,5/13-G-3,5OrderNo.:18437...
2024-12-12403227.02 KB4页65
IC封装资料_连接器_1843703.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV1,5/12-G-3,5OrderNo.:18437...
2024-12-121515227.35 KB4页201
IC封装资料_电源管理芯片_MGJ2D152005SC.pdf
MGJ2Series5.2kVDCIsolated2WGateDriveDC-DCConvertersKDC_MGJ2_G01Page1of9www.murata-ps.comwww.murata-ps.com/supportForfulldetailsgot...
2024-12-12223321.61 KB9页223
IC封装资料_电容_GRM1885C1H221GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1259944.07 KB30页206
IC封装资料_电源管理芯片_ME6219C28M5G.pdf
南京微盟电子有限公司第1页共8页www.microne.com.cn电话：025-84731186ME6219系列线性稳压器Ver08300mA，超低噪声，超快响应LDO线性稳压器...
2024-12-121654353.77 KB8页197
IC封装资料_电容_GRM1885C1H220JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1254944.07 KB30页8
IC封装资料_电容_GRM155R71H123KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12487920.26 KB29页291
IC封装资料_电容_CL21C070DBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127077.46 MB84页42
IC封装资料_电容_CL10B182KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B182KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-121461.45 MB36页56
IC封装资料_电容_0805F106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128231.05 MB27页143
IC封装资料_电容_CC0402JRNPO9BN101.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12100217.81 MB176页293

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