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IC资料

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IC封装资料_电容_0805N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214751.26 MB20页89
IC封装资料_电容_CL31B225KCHSNNE.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL31B225KCHSNNEProduct:Multi-layerCeramicCapacitor...
2024-12-125381.43 MB36页91
IC封装资料_电感_YNR8040-680M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121356666.38 KB5页222
IC封装资料_连接器_A2541HWV-15P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121397814.87 KB16页115
IC封装资料_电源管理芯片_MT3608.pdf
1AerosemiTechnologyCo.,LtdMT3608AEROSEMIHighEfficiency1.2MHz2AStepUpConverterFEATURES•Integrated80mΩPowerMOSFET•2Vto24VInputVol...
2024-12-121590690.53 KB7页174
IC封装资料_连接器_A2541HWV-14P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12527814.88 KB16页201
IC封装资料_电容_GRM155R71H683KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121074920.26 KB29页271
IC封装资料_电容_GRM1885C1H910JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12777944.07 KB30页16
IC封装资料_电容_CL10B224JP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224JP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12534361.19 KB3页173
IC封装资料_电容_GRM1885C1H910GA01D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-12318439.31 KB1页188
IC封装资料_电容_0805N101J251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128921.26 MB20页33
IC封装资料_电容_GRM1885C1H822JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12301944.07 KB30页2
IC封装资料_电容_CL31B475KBHNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B475KBHNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-1216941.47 MB36页283
IC封装资料_电感_YNR8040-681M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12171666.38 KB5页222
IC封装资料_电感_YNR8040-821M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121134666.38 KB5页181
IC封装资料_电容_CL31B226KPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B226KPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-128611.48 MB36页137
IC封装资料_电源管理芯片_NCP308MTADJTBG.pdf
©SemiconductorComponentsIndustries,LLC,2014December,2014−Rev.61PublicationOrderNumber:NCP308/DNCP308,NCV308LowQuiescentCurrent,P...
2024-12-121306222.63 KB11页60
IC封装资料_电容_CC0402JRNPO9BN270.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12188617.81 MB176页140
IC封装资料_电源管理芯片_NCP160AMX320TBG.pdf
©SemiconductorComponentsIndustries,LLC,2017March,2020−Rev.171PublicationOrderNumber:NCP160/DLDORegulatorforRFandAnalogCircuits-U...
2024-12-12216914.16 KB21页90
IC封装资料_电容_CL10B224KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12676259.57 KB3页136

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