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IC资料

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IC封装资料_电感_LQP03TN4N3H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121759281.03 KB12页203
IC封装资料_连接器_1725656.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1284136.13 MB445页38
IC封装资料_电源管理芯片_AP2120N-3.3TRG1.pdf
AP2120Documentnumber:DS41206Rev.4-21of25www.diodes.comJune2019©DiodesIncorporatedAP2120HIGHSPEED,EXTREMELYLOWNOISELDOREGULATORDes...
2024-12-121304805.16 KB25页152
IC封装资料_电容_CC0603JRNPO0BN121.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12865998.46 KB11页294
IC封装资料_电感_LQP03TN5N6H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12617281.03 KB12页132
IC封装资料_电感_LQP03TN4N7H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121940281.03 KB12页77
IC封装资料_电源管理芯片_AP2127K-ADJTRG1.pdf
AP2127Documentnumber:DS36478Rev.7-21of24www.diodes.comDecember2017©DiodesIncorporatedAP2127300mAHIGHSPEED,EXTREMELYLOWNOISECMOSLD...
2024-12-1217281010.23 KB24页67
IC封装资料_电容_GCM155R71H472KA37D.pdf
GCM155R71H472KA37_(0402,X7R:EIA,4700pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121719948.82 KB29页28
IC封装资料_电容_CC0603JRNPO0BN331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213991.22 MB13页62
IC封装资料_电容_CC0603JRNPO0BN221.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121177998.46 KB11页90
IC封装资料_电容_0201CG200J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216841.05 MB27页35
IC封装资料_电容_0201CG180K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215221.05 MB27页218
IC封装资料_电感_LQP03TN5N6J02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12944281.03 KB12页212
IC封装资料_电源管理芯片_AP2127N-2.8TRG1.pdf
AP2127Documentnumber:DS36478Rev.7-21of24www.diodes.comDecember2017©DiodesIncorporatedAP2127300mAHIGHSPEED,EXTREMELYLOWNOISECMOSLD...
2024-12-128441010.23 KB24页146
IC封装资料_电容_GCM155R71H473KE02D.pdf
GCM155R71H473KE02_(0402,X7R:EIA,47000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121381934.88 KB29页98
IC封装资料_电容_CC0603JRNPO0BN470.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121954998.46 KB11页41
IC封装资料_电容_0201CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217101.05 MB27页227
IC封装资料_电感_LQP03TN6N8H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12206281.04 KB12页152
IC封装资料_电感_LQP03TN6N2H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121668281.03 KB12页37
IC封装资料_电源管理芯片_AP2204K-3.3TRG1.pdf
AP2204Documentnumber:DS37168Rev.5-21of18www.diodes.comJuly2018©DiodesIncorporatedAP2204WIDEINPUTVOLTAGERANGE,150mAULDOREGULATORDe...
2024-12-12669890.63 KB18页71

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