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IC封装资料_电容_1206CG3R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122751.05 MB27页251
IC封装资料_电容_SPZ1AM221D09000RAXXX.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12198815.39 MB230页271
IC封装资料_电感_YPRH105R-221M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12669765.25 KB5页275
IC封装资料_电源管理芯片_TL431BMFDT_215.pdf
TL431familyAdjustableprecisionshuntregulatorsRev.6—9January2019Productdatasheet1.Productprofile1.1.GeneraldescriptionThree-termin...
2024-12-121947508.79 KB19页276
IC封装资料_电容_CL10B561KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121698452.9 KB21页58
IC封装资料_电容_1206CG4R7C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124981.05 MB27页248
IC封装资料_电容_EXV107M035A9MAA.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardA4003_EXV•7/31/2019FortLauderdale,FL33301USA•954-766-2800•ww...
2024-12-1213084.06 MB19页140
IC封装资料_电感_YPRH105R-330M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121561765.25 KB5页254
IC封装资料_电源管理芯片_TL431BMFDT8VL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121773278.43 KB28页33
IC封装资料_连接器_DF13E-20DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-12914264.15 KB2页145
IC封装资料_连接器_DF13E-10DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121026264.15 KB2页279
IC封装资料_电源管理芯片_TL431BMFDT8R.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12220278.43 KB28页215
IC封装资料_连接器_DF12E_5.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12118288.67 KB11页104
IC封装资料_电容_GRM188R71E104MA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121427944.07 KB30页202
IC封装资料_电容_F971C106MAA.pdf
108071119F97SeriesResin-MoldedChip,ImprovedReliabilityJ-LeadLEAD-FREECOMPATIBLECOMPONENTLHSW1W2SLHSW1W2SA,BCASEC,NCASEF97Type1CRat...
2024-12-121024334.34 KB5页126
IC封装资料_连接器_DF13E-40DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121794264.15 KB2页294
IC封装资料_电容_CL10B562KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121144259.58 KB3页175
IC封装资料_连接器_DF13E-30DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121524264.15 KB2页54
IC封装资料_电容_CL10B562JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121425360.96 KB3页56
IC封装资料_电容_FC0H224ZFTBR24.pdf
1©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comS6011_FC•3/29/2017Oneworld.OneKEMETBe...
2024-12-121806867.01 KB16页70

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