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IC资料

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IC封装资料_连接器_KF103-5.0-2P.pdf
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2024-12-12512205.01 KB1页30
IC封装资料_电容_GRM188R71H331KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12521944.07 KB30页126
IC封装资料_连接器_KF2EDGR-Y-3.81-14P.pdf
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2024-12-121981192.45 KB1页7
IC封装资料_电容_CL10C0R5BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12574259.58 KB3页135
IC封装资料_连接器_KF2EDGR-Y-3.81-13P.pdf
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2024-12-121422192.45 KB1页125
IC封装资料_电容_CL10C0R3CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121595340.1 KB3页58
IC封装资料_连接器_KF2EDGR-Y-3.81-12P.pdf
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2024-12-121353192.45 KB1页155
IC封装资料_连接器_KF2EDGR-Y-3.81-11P.pdf
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2024-12-12765192.45 KB1页285
IC封装资料_电容_1206CG470J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210921.05 MB27页172
IC封装资料_电容_T491D336M016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1216471.54 MB23页131
IC封装资料_电感_YPRH1207-8R2M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121040737.49 KB5页7
IC封装资料_电容_GCJ31MR72A224KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212434.17 MB96页124
IC封装资料_电感_YPRH1207-6R8M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121697737.49 KB5页209
IC封装资料_连接器_KF103-5.0-4P.pdf
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2024-12-121661205.01 KB1页163
IC封装资料_电源管理芯片_TLV75733PDBVR.pdf
Time(ms)Voltage(V)OutputCurrent(mA)00.20.40.60.811.21.41.61.82001252503754100512561507175VOUTVINVENIOUTTLV757PINENOUTGNDCOUTCINONO...
2024-12-1219292.52 MB36页270
IC封装资料_连接器_KF103-5.0-3P.pdf
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2024-12-121298205.01 KB1页210
IC封装资料_电容_T491D475K050AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211671.54 MB23页157
IC封装资料_电容_GRM188R71H332KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12840944.07 KB30页182
IC封装资料_电容_CL10C0R5BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121988340.06 KB3页14
IC封装资料_连接器_KF103-5.0-8P.pdf
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2024-12-121953205.01 KB1页182

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