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IC资料

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IC封装资料_电源管理芯片_TP5602.pdf
南京拓品微电子有限公司NanJingTopPowerASICCorp.1REV_2.0南京拓品微电子有限公司NanJingTopPowerASICCorp.数据手册DATASHEETTP5602移动电...
2024-12-1213751.46 MB22页8
IC封装资料_连接器_OSTTC022162.pdf
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2024-12-121998177.09 KB1页257
IC封装资料_连接器_MicroXNJ.pdf
深圳市首韩科技有限公司SHENZHENSHOUHANTECHNOLOGYCO.,LTDTel:0755-27597601Fax:0755-27597491承认SPECIFICATION书FORAPPROVAL客户Customer...
2024-12-1210631.22 MB2页12
IC封装资料_电容_GRM188R71H683KA93D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12603944.07 KB30页49
IC封装资料_电容_TAJA225K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121117210.32 KB7页89
IC封装资料_电容_1206F224M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126501.05 MB27页293
IC封装资料_电容_TAJA225K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121504210.32 KB7页296
IC封装资料_电容_GCJ188R71E154KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1211285.94 MB73页122
IC封装资料_电容_1206F223M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127731.05 MB27页67
IC封装资料_电感_YPRH1209-330M.pdf
SMDPowerInductors-YPRH1209Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12573736.23 KB5页214
IC封装资料_连接器_PF2-J240-SAB-G0-TR.pdf
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2024-12-121546341.77 KB1页229
IC封装资料_电容_GRM188R71H821KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121215944.07 KB30页106
IC封装资料_连接器_PF2-J230-SAB-G0-TR.pdf
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2024-12-121731341.77 KB1页39
IC封装资料_连接器_PF1-M240-SBB-G0-TR.pdf
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2024-12-12211262.65 KB1页289
IC封装资料_电容_CL10C3R3BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121009316.2 KB3页276
IC封装资料_电容_TAJA225M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12461210.32 KB7页217
IC封装资料_电容_CL10C3R3BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12828259.58 KB3页37
IC封装资料_电容_TAJA225M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121329210.32 KB7页214
IC封装资料_电容_1206F225M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218811.05 MB27页52
IC封装资料_电容_TAJA225M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121368210.32 KB7页37

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