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IC资料

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IC封装资料_电源管理芯片_BQ24195RGER.pdf
VBUSPMIDOTGD+D–STATSDASCLINTCESWBTSTREGNPGNDSYSBATILIMTS1TS2+3.3VHostREGNREGNUSB3.9V–17Vbq24195LPhoneTabletBATTERYQ1CSD25302Q2C5...
2024-12-1215983.74 MB50页113
IC封装资料_电容_GCM188R71H152KA37D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1210253.23 MB2页63
IC封装资料_电容_0201X472K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129671.05 MB27页223
IC封装资料_电感_LQW15AN33NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121755376.63 KB15页297
IC封装资料_电容_CC0603JRNPO9BN270.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1246417.81 MB176页296
IC封装资料_电容_0201X473K6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128891.05 MB27页4
IC封装资料_电感_LQW15AN33NH00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121283376.63 KB15页54
IC封装资料_电源管理芯片_BQ24232RGTR.pdf
INVSSBATDCGNDAdaptorbq24230CEOUTCHGPGOODTMREN1EN2TSILIMISETTEMPPACK+PACK-SYSTEMTD138154146121612351011971�F4.7�F1kΩ2.94kΩ1kΩ4...
2024-12-126332.85 MB46页125
IC封装资料_电容_GCM188R71H153KA37D.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-126431.67 MB57页257
IC封装资料_电容_0201X473K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217071.05 MB27页103
IC封装资料_电感_LQW15AN33NJ0ZD.pdf
Lsize1.0±0.1mmWsize0.5±0.1mmTsize0.5±0.1mmSizecodeininch(mm)0402(1005)PackagingcodeSpecificationsMinimumquantityDφ180mmPaperta...
2024-12-122461.97 MB2页65
IC封装资料_电感_LQW15AN33NJ00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12863343.85 KB14页211
IC封装资料_电源管理芯片_BQ24250RGER.pdf
SystemLoad33nFCBOOTSYSPGNDSWINVINCIN2.2µFBOOT1.0µHSCLISETLO3MHzPWMVDPM/CEILIMHostSCLSDAGPIO1GPIO2SDAINTLDOSTAT1µF+BATTEMPPACK+P...
2024-12-1213094.78 MB59页194
IC封装资料_电容_GCM188R71H154KA64D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1216674.17 MB96页54
IC封装资料_电容_0201X474M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211811.05 MB27页152
IC封装资料_电容_0201X473M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217471.05 MB27页224
IC封装资料_电感_LQW15AN39NJ00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121655376.63 KB15页140
IC封装资料_电感_LQW15AN39NG00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121063376.63 KB15页269
IC封装资料_电容_CC0603JRNPO9BN272.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12201998.46 KB11页33
IC封装资料_电源管理芯片_BQ24253RGER.pdf
SystemLoad33nFCBOOTSYSPGNDSWINVINCIN2.2µFBOOT1.0µHSCLISETLO3MHzPWMVDPM/CEILIMHostSCLSDAGPIO1GPIO2SDAINTLDOSTAT1µF+BATTEMPPACK+P...
2024-12-1219764.82 MB59页261

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