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IC资料

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IC封装资料_电感_CBC2518T4R7M.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment(GeneralEnvironment)]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts...
2024-12-12236915.03 KB15页213
IC封装资料_电感_BRC2012T2R2MD.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-12665690.62 KB12页233
IC封装资料_连接器_9631S-45Z02-GFN4.pdf
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2024-12-121097204.61 KB1页208
IC封装资料_连接器_9631S-44Z02-GFN4.pdf
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2024-12-12512204.61 KB1页125
IC封装资料_电容_UMA1H100MDD.pdf
170ALUMINUMELECTROLYTICCAPACITORSCAT.8100HU1M2A314E5160708M9D10D1112Configuration2SizecodeCapacitancetolerance(±20%)Ratedcapacita...
2024-12-121900592.14 KB1页277
IC封装资料_电容_GCM21BR71H473KA37L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1210105.94 MB73页207
IC封装资料_电容_0201B102J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123751.05 MB27页91
IC封装资料_电容_16SVP22M.pdf
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.S...
2024-12-12711288.69 KB3页94
IC封装资料_电感_CBMF1608T470K.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-12643364.38 KB3页79
IC封装资料_电感_CBMF1608T100K.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-12595364.56 KB3页8
IC封装资料_连接器_9631S-46Z02-GFN4.pdf
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2024-12-12403204.61 KB1页176
IC封装资料_电容_UMK105B7471KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121838653.27 KB26页298
IC封装资料_电容_GCM21BR71H474KA55L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-122494.17 MB96页8
IC封装资料_电容_0201B102K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219731.05 MB27页206
IC封装资料_电感_CDRH127NP-100MC.pdf
SMDPowerInductorCDRH127Page1of6Revised:6-Jan-17Description•Ferritedrumcoreconstruction.•Magneticallyshielded.•L×W×H:12.3×12....
2024-12-121665450.93 KB6页18
IC封装资料_连接器_9631S-47Z02-GFN4.pdf
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2024-12-12429204.61 KB1页125
IC封装资料_电容_UMK105B7561KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12871653.27 KB26页74
IC封装资料_电容_0201B102K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128111.05 MB27页95
IC封装资料_电感_CI160808-R10J.pdf
CI160808Series-Multi-LayerChipInductorsBournsPartNo.InductanceQTestFreq.SRFMHzDCRIrmsnHTol.%min.L,QMHzmin.typ.ohmmax.mAmax.CI16080...
2024-12-12178325.52 KB3页212
IC封装资料_连接器_9631S-50Z02-GFN4.pdf
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2024-12-12440204.61 KB1页147

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