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IC资料

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IC封装资料_电源管理芯片_LT1761ES5-2.5_TRMPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1219781.21 MB22页180
IC封装资料_电感_MLK1005S15NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12559209.31 KB10页114
IC封装资料_电容_GJM0335C1HR50BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12102410.43 MB296页284
IC封装资料_电源管理芯片_LM317LIPK.pdf
C1=0.1µFVI470�R1R2C2=1µFVOAdjustmentOutputInputLM317LProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLM...
2024-12-1215221.77 MB33页269
IC封装资料_电感_MLK1005S22NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12912209.31 KB10页166
IC封装资料_电感_MLK1005S18NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-12499209.31 KB10页5
IC封装资料_电容_CC0805KRX7R0BB471.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218151.22 MB13页282
IC封装资料_电源管理芯片_LM317MKVURG3.pdf
INPUTADJUSTINPUTOUTPUTADJUSTOUTPUTOUTPUTKVU(TO-252)PACKAGE(TOPVIEW)OUTPUTINPUTADJUSTOUTPUTKTP(PFM)PACKAGE(TOPVIEW)DCY(SOT-223)PACK...
2024-12-121251.11 MB23页288
IC封装资料_电容_0603B203K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125291.05 MB27页223
IC封装资料_电源管理芯片_LM317MDCYR.pdf
INPUTADJUSTINPUTOUTPUTADJUSTOUTPUTOUTPUTKVU(TO-252)PACKAGE(TOPVIEW)OUTPUTINPUTADJUSTOUTPUTKTP(PFM)PACKAGE(TOPVIEW)DCY(SOT-223)PACK...
2024-12-1218441.11 MB23页277
IC封装资料_电容_0603B202K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218541.05 MB27页90
IC封装资料_电源管理芯片_LM317MBDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014May,2019−Rev.261PublicationOrderNumber:LM317M/DLM317M,NCV317MA,NCV317M500mAAdjustable...
2024-12-12819324.57 KB15页223
IC封装资料_电感_NLV25T-330J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12461316.79 KB6页72
IC封装资料_电容_GCM1555C1H471JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214244.17 MB96页106
IC封装资料_电感_NLV25T-270J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-1273215.06 KB9页5
IC封装资料_电源管理芯片_LT1761ES5-3.3_TRPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1216851.21 MB22页95
IC封装资料_电容_CC0805KRX7R0BB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124451.22 MB13页291
IC封装资料_电容_0402CG100B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216791.05 MB27页178
IC封装资料_电容_0603B221K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215131.05 MB27页262
IC封装资料_电容_0402CG9R1C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12611.05 MB27页179

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