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IC封装资料_电容_GRM21BR60J106KE19L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1220910.43 MB296页123
IC封装资料_电源管理芯片_LTC3803HS6-5_TRPBF.pdf
LTC3803-5138035fdTYPICALAPPLICATIONDESCRIPTIONConstantFrequencyCurrentModeFlybackDC/DCControllerinThinSOTTheLTC®3803-5isaconstant...
2024-12-12136250.58 KB16页2
IC封装资料_电容_GRM033R61C473KE84D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1224210.43 MB296页29
IC封装资料_电容_CL03A103KP3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-12811.42 MB36页268
IC封装资料_电容_CL10A105KP8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12926259.58 KB3页200
IC封装资料_电容_0603N3R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216951.26 MB20页228
IC封装资料_电容_0805B152K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121361.26 MB20页174
IC封装资料_电感_SWPA3010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125101.32 MB22页178
IC封装资料_电感_SWPA3010S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124031.32 MB22页17
IC封装资料_连接器_1757352.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152436.13 MB445页4
IC封装资料_电感_SWPA6020S3R3NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212751.32 MB22页193
IC封装资料_电源管理芯片_LTC3824EMSE_TRPBF.pdf
LTC382413824fhFormoreinformationwww.linear.com/LTC3824TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighVoltageStep-DownControl...
2024-12-121588460.71 KB16页101
IC封装资料_电源管理芯片_LTC3814EFE-5_TRPBF.pdf
LTC3814-5138145fc60VCurrentModeSynchronousStep-UpControllerTheLTC3814-5isasynchronousstep-upswitchingregu-latorcontrollerthatcange...
2024-12-12527441.65 KB30页254
IC封装资料_电容_CL10A105KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A105KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121588361.13 KB3页58
IC封装资料_电容_CL10A105KQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121095259.58 KB3页61
IC封装资料_电容_0805B152K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217471.05 MB27页26
IC封装资料_电感_SWPA6020S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121741.32 MB22页38
IC封装资料_电容_0805B153K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126001.05 MB27页120
IC封装资料_电感_SWPA6020S5R6NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129401.32 MB22页52
IC封装资料_电源管理芯片_LTC3826IG-1_PBF.pdf
LTC3826-1138261fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION30µAIQ,Dual,2-PhaseSynchronousStep-DownControllernAutomotiveSys...
2024-12-121009511.93 KB32页268

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