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IC封装资料_电源管理芯片_LTC3864EDE_PBF.pdf
LTC386413864faFormoreinformationwww.linear.com/LTC3864TypicalapplicaTionFeaTuresDescripTion60VLowIQStep-DownDC/DCControllerwith100...
2024-12-12756771.71 KB30页267
IC封装资料_电容_0603N181J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211961.26 MB20页4
IC封装资料_电容_CL10A106MR5LQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121326259.58 KB3页233
IC封装资料_电感_SWPA3015S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214191.32 MB22页98
IC封装资料_电容_0805B221K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218401.05 MB27页259
IC封装资料_电容_CL03A225MQ3CRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1212041.42 MB36页203
IC封装资料_电容_0603N220J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217671.26 MB20页21
IC封装资料_电感_SWPA6028S180MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页231
IC封装资料_电容_0603N200J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210051.26 MB20页252
IC封装资料_电源管理芯片_LTC3865IUH-1_TRPBF.pdf
LTC3865/LTC3865-113865fbTYPICALAPPLICATIONDESCRIPTIONDual,2-PhaseSynchronousDC/DCControllerwithPinSelectableOutputsTheLTC®3865/LT...
2024-12-12300488.22 KB38页86
IC封装资料_电感_SWPA3015S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121041.32 MB22页115
IC封装资料_电容_GRM155B30J225KE95D.pdf
Lsize1.0±0.05mmWsize0.5±0.05mmTsize0.5±0.05mmExternalterminalwidthe0.15to0.35mmDistancebetweenexternalterminalsg0.3mmmin.Sizeco...
2024-12-1215543.21 MB2页126
IC封装资料_电感_SWPA3015S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122041.32 MB22页85
IC封装资料_电源管理芯片_LTC3119EUFD_TRPBF.pdf
LTC311913119fbFormoreinformationwww.linear.com/LTC3119TypicalapplicaTionFeaTuresDescripTion18V,5ASynchronousBuck-BoostDC/DCConvert...
2024-12-1219352.69 MB36页168
IC封装资料_电容_CL10A224KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121749259.58 KB3页48
IC封装资料_电容_GRM21BR61E226ME44L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1288510.43 MB296页44
IC封装资料_电容_0805B221K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126591.26 MB20页187
IC封装资料_电感_SWPA6028S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216481.32 MB22页62
IC封装资料_连接器_1758089.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12181936.13 MB445页13
IC封装资料_电容_CL03A473KQ3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-121601.42 MB36页32

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