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IC资料

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IC封装资料_电子开关_SN080104RSER.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122872.65 MB30页153
IC封装资料_电源管理芯片_LTC4062EDD_TRPBF.pdf
LTC406214062fb■ChargeCurrentProgrammableUpto1A■ChargesSingle-CellLi-IonBatteriesDirectlyfromUSBPort■PresetFloatVoltagewith±0.3...
2024-12-121479263.04 KB20页253
IC封装资料_电容_GRM1555C1H101FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121762920.26 KB29页293
IC封装资料_电容_CL10A335MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A335MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121501.42 MB36页105
IC封装资料_电容_CL10A335KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12724259.58 KB3页84
IC封装资料_电容_GRM1555C1H100JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12487920.26 KB29页87
IC封装资料_电容_0805B333K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215381.26 MB20页151
IC封装资料_电容_CL10C332JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121472259.58 KB3页268
IC封装资料_电容_CL10C332JB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12286259.58 KB3页176
IC封装资料_电感_SWPA8040S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210821.32 MB22页288
IC封装资料_电容_CL10C332JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121995316.41 KB3页231
IC封装资料_电容_CL10C331JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121048259.57 KB3页273
IC封装资料_电源管理芯片_LTC4065EDC_TRPBF.pdf
1LTC4065/LTC4065A4065fb■WirelessPDAs■CellularPhones■PortableElectronicsStandalone750mALi-IonBatteryChargerin2×2DFN■CompleteLi...
2024-12-121425292.13 KB16页118
IC封装资料_电容_C0603NP0180JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1217471.92 MB48页47
IC封装资料_电源管理芯片_LTC4065AEDC_TRMPBF.pdf
1LTC4065/LTC4065A4065fb■WirelessPDAs■CellularPhones■PortableElectronicsStandalone750mALi-IonBatteryChargerin2×2DFN■CompleteLi...
2024-12-12272292.13 KB16页212
IC封装资料_电阻_4D03WGJ0220T5E.pdf
厚聲國際貿易（昆山）有限公司深圳分公司UniroyalElectronicsGlobalCo.,LtdShenzhenBranchSpecificationforApprovalBuilding8,JiuweiIndust...
2024-12-121485674.28 KB14页141
IC封装资料_电容_CL10A474KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12665259.58 KB3页133
IC封装资料_电容_GRM1555C1H101GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121285920.26 KB29页33
IC封装资料_电容_CL10A474KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121131259.58 KB3页117
IC封装资料_电容_CL10C360JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121789316.3 KB3页84

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