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IC封装资料_电容_CL10C391JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12177316.29 KB3页208
IC封装资料_电容_0805B361K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124451.05 MB27页289
IC封装资料_电感_SWPA8040S120MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123281.32 MB22页2
IC封装资料_电容_C0603X7R221KGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1218011.92 MB48页70
IC封装资料_电源管理芯片_LTC4089EDJC_PBF.pdf
LTC4089/LTC4089-5140895fdFormoreinformationwww.linear.com/LTC4089ApplicAtionsHVINBOOSTHVENINSW4.7µF10µF4.7µF1µFTIMERCLPROGLTC4...
2024-12-121788806 KB26页34
IC封装资料_电阻_3266W-1-502.pdf
产品品牌博晨（BOCHEN)3266W型玻璃釉预调电位器技术承认书拟制：审核：批准：更多资料下载请到五八文库wk.58sms.com3266W型玻璃釉预调电位...
2024-12-121714184.83 KB4页82
IC封装资料_电容_GRM155R60J824KE19D.pdf
GRM155R60J824KE19_(0402,X5R:EIA,0.82uF,DC6.3V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-12441924.51 KB29页200
IC封装资料_电阻_3224W-1-103E.pdf
3224WTopAdjust5.3(.208)0.2(.007)0.7(.028)1.0(.040)0.8(.032)5.1(.200)4.8(.190)1.3(.050)2.5(.100)2.9(.114)3123.5(.139)1.5(.060)3.9(....
2024-12-12604368.33 KB2页37
IC封装资料_电容_GRM1555C1H120FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12581920.26 KB29页96
IC封装资料_电容_GRM1555C1H110JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121576920.26 KB29页209
IC封装资料_电容_CL10A475KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121732259.58 KB3页79
IC封装资料_电容_0805B391K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218731.05 MB27页101
IC封装资料_电容_CL10C391JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C391JB81PNC●Product:Multi-layerCeramicCapacitorCAP,390㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1219035.8 MB36页294
IC封装资料_电感_SWPA8040S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1215161.32 MB22页4
IC封装资料_电感_SWPA8040S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123781.32 MB22页148
IC封装资料_电容_C0603X7R471KGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1218321.92 MB48页218
IC封装资料_连接器_1803510.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12184036.13 MB445页206
IC封装资料_电源管理芯片_LTC4089EDJC_TRPBF.pdf
LTC4089/LTC4089-5140895fdFormoreinformationwww.linear.com/LTC4089ApplicAtionsHVINBOOSTHVENINSW4.7µF10µF4.7µF1µFTIMERCLPROGLTC4...
2024-12-12705806 KB26页277
IC封装资料_电容_GRM155R61A103KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121507920.26 KB29页64
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1216001.42 MB36页280

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