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IC资料

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IC封装资料_电容_CL10C470JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-128901.42 MB36页188
IC封装资料_电容_CL10C470JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121046316.3 KB3页158
IC封装资料_电感_SWPA8040S270MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217181.32 MB22页27
IC封装资料_电感_SWPA8040S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216681.32 MB22页31
IC封装资料_电容_C822E474J90C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124162.9 MB5页244
IC封装资料_电源管理芯片_LTC4151IMS_TRPBF.pdf
LTC415114151ffFormoreinformationwww.linear.com/LTC4151TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighVoltageI2CCurrentandVol...
2024-12-12158518.65 KB18页216
IC封装资料_连接器_1804755.pdf
https://www.phoenixcontact.com/pi/products/180475504/09/2019Page1/4Feed-throughheader-PCV4/9-G-7,62-1804755Pleasebeinformedthatthe...
2024-12-121115216.99 KB4页238
IC封装资料_电阻_EXBN8V101JX.pdf
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.S...
2024-12-12602215.04 KB6页205
IC封装资料_电容_GRM155R61A105KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12104920.26 KB29页195
IC封装资料_电容_GRM1555C1H121JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121971920.26 KB29页289
IC封装资料_电容_C822J103J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1215992.9 MB5页36
IC封装资料_电容_CL10A475KQ5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KQ5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1212911.45 MB36页46
IC封装资料_连接器_1804771.pdf
https://www.phoenixcontact.com/us/products/180477110/27/2014Page1/4Basestrip-PCV4/11-G-7,62-1804771Pleasebeinformedthatthedatashow...
2024-12-121555161.73 KB4页72
IC封装资料_电阻_FMF25FPJR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121577367.83 KB10页80
IC封装资料_电阻_FMF06FTHR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121041367.83 KB10页102
IC封装资料_电容_0805B471K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124491.26 MB20页13
IC封装资料_电源管理芯片_LTC4210-1CS6_TRPBF.pdf
LTC4210-1/LTC4210-21421012faFormoreinformationwww.linear.com/LTC4210-1TYPICALAPPLICATIONFEATURESDESCRIPTIONHotSwapControllerin6-Le...
2024-12-121592574.87 KB22页101
IC封装资料_电容_GRM1555C1H130GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121559920.26 KB29页138
IC封装资料_电容_CL10C470JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12109259.58 KB3页199
IC封装资料_电容_CL10C470JB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C470JB81PNCProduct:Multi-layerCeramicCapacitorCAP,47,50V,±5%,C0G,0603AEC-Q200QualifiedA.Dime...
2024-12-126626.16 MB36页224

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