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IC封装资料_电源管理芯片_LTC4357IMS8_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-121749840.98 KB14页175
IC封装资料_过压保护_CD143A-SR70.pdf
*RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.**Bournsfollowstheprevailingdefinitionof“halog...
2024-12-12750226.05 KB4页76
IC封装资料_电容_GRM155R61C105KE01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1250710.43 MB296页108
IC封装资料_过压保护_AZC099-04S.pdf
AZC099-04SLowCapacitanceESDProtectionArrayForHighSpeedDataInterfacesRevision2011/07/30©2011-2012AmazingMicro.1www.amazingIC.comFe...
2024-12-12147270.39 KB12页72
IC封装资料_电容_GRM1555C1H271JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12444920.26 KB29页213
IC封装资料_电容_GRM1555C1H271GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12245920.26 KB29页139
IC封装资料_电容_CL10C751JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12971452.9 KB21页295
IC封装资料_电容_CL10C751JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12917316.29 KB3页159
IC封装资料_电容_CL10B102KC8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KC8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12496368.85 KB3页178
IC封装资料_电容_CL10C750JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12826316.29 KB3页275
IC封装资料_电容_0805B563K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125621.26 MB20页28
IC封装资料_电容_C1608X5R1E225K080AB.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-121241.65 MB57页210
IC封装资料_过压保护_PESD5V0S1BL.pdf
PESD5V0S1BLLowcapacitancebidirectionalESDprotectiondiode15May2018Productdatasheet1.GeneraldescriptionVerylowcapacitancebidirection...
2024-12-12112289.56 KB14页206
IC封装资料_过压保护_P0300SCLRP.pdf
SIDACtor®ProtectionThyristors©2017Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.Revised:02/23/17BasebandProtectio...
2024-12-121441928.83 KB6页227
IC封装资料_电容_0805B562K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219781.26 MB20页267
IC封装资料_电感_VLCF4020T-2R2N1R7.pdf
INDUCTORSApril2016WoundFerriteVLCF4020InductorsforPowerCircuitsVLCF4020TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDU...
2024-12-121133195.26 KB9页49
IC封装资料_过压保护_DESD1P0RFW-7.pdf
DESD1P0RFWDocumentnumber:DS35278Rev.5-21of4www.diodes.comSeptember2011©DiodesIncorporatedDESD1P0RFWADVANCEINFORMATIONLOWCAPACITAN...
2024-12-121059173.74 KB5页293
IC封装资料_电容_GRM1555C1H300JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12753920.26 KB29页284
IC封装资料_电源管理芯片_LTC4359IDCB_TRPBF.pdf
LTC43591Rev.EFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONIdealDiodeControllerwithReverseI...
2024-12-1218821.3 MB20页236
IC封装资料_电容_CL10C820GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121856316.18 KB3页154

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