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IC资料

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IC封装资料_电源管理芯片_MCP73832T-2ACI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-121463915.7 KB28页89
IC封装资料_连接器_1830716.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1279736.13 MB445页159
IC封装资料_电容_GRM155R71E333KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121967920.26 KB29页192
IC封装资料_电容_CL10B153JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121644360.63 KB3页279
IC封装资料_电感_YNR5020-151M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121647664.7 KB5页9
IC封装资料_电容_GRM155R71E393KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121748920.26 KB29页262
IC封装资料_电容_CL10B153KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12110361.71 KB3页239
IC封装资料_电容_0805CG821J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128351.05 MB27页188
IC封装资料_电感_YNR5020-220M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121144664.7 KB5页240
IC封装资料_电容_GRM1885C1H122JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121090944.07 KB30页93
IC封装资料_电容_GRM155R71E472KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12794920.26 KB29页69
IC封装资料_电容_CL21B562KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-126487.46 MB84页11
IC封装资料_电容_CL10B153KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12357259.58 KB3页153
IC封装资料_电容_CL10B153KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12123259.58 KB3页190
IC封装资料_电容_CC0402FRNPO9BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218751.22 MB13页92
IC封装资料_电容_0805F103M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215861.05 MB27页255
IC封装资料_电容_GRM1885C1H130GA01D.pdf
GRM1885C1H130GA01_(0603,C0G:EIA,13pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121509944.08 KB30页197
IC封装资料_电容_CC0402FRNPO9BN330.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121043998.46 KB11页200
IC封装资料_电容_0805CG910J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122941.05 MB27页118
IC封装资料_电容_GRM1885C1H130JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121079944.07 KB30页227

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