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IC资料

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IC封装资料_电容_CL21C1R5CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-125217.46 MB84页69
IC封装资料_连接器_1830732.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12166136.13 MB445页99
IC封装资料_电容_GRM1885C1H162JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12531944.07 KB30页162
IC封装资料_电容_GRM1885C1H161JA01D.pdf
GRM1885C1H161JA01_(0603,C0G:EIA,160pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12384944.12 KB30页269
IC封装资料_电容_CL21C3R9CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210751.39 MB36页198
IC封装资料_电容_CL21C3R3CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121187.46 MB84页85
IC封装资料_电容_CC0402JRNPO9BN100.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12104417.81 MB176页177
IC封装资料_电容_GRM1885C1H180GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121354944.07 KB30页106
IC封装资料_电容_GRM1885C1H180FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12940944.07 KB30页260
IC封装资料_电容_CL21C4R7CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123247.55 MB84页193
IC封装资料_电容_CL10B153KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12401452.9 KB21页113
IC封装资料_电容_0805F104M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123851.05 MB27页9
IC封装资料_电感_YNR5040-1R5M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121991666.66 KB5页120
IC封装资料_电容_GRM1885C1H180JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12151944.07 KB30页272
IC封装资料_电源管理芯片_ME6119A30PG.pdf
V06www.microne.com.cnPage1of10ME6119400mA带载、18V耐压、低压差快速响应LDO概述ME6119是一款高精度、低噪声、低压差、保护功能齐全的的L...
2024-12-121497473.67 KB10页103
IC封装资料_电源管理芯片_ME6118A12B3G.pdf
V10.0www.microne.com.cnPage1of17ME61181AAdjustableVoltageHighSpeedLDORegulatorsME6118SeriesGeneralDescriptionFeaturesTypicalApplic...
2024-12-121666746.33 KB17页133
IC封装资料_电容_GRM155R71E682KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12402920.26 KB29页195
IC封装资料_电容_CL10B154KA8NFNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-1263452.9 KB21页24
IC封装资料_电容_CL10B153KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12385361.31 KB3页300
IC封装资料_电容_0805F104Z500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213901.05 MB27页23

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