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IC资料

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IC封装资料_连接器_A2541HWV-20P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12493814.89 KB16页231
IC封装资料_电容_0805N120J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210591.26 MB20页26
IC封装资料_电容_GRM1885C1HR60BA01D.pdf
GRM1885C1HR60BA01_(0603,C0G:EIA,0.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121643944.08 KB30页184
IC封装资料_电感_YP0301-6R8M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121704719.3 KB5页281
IC封装资料_电容_GRM1885C1HR50CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12854944.07 KB30页165
IC封装资料_电感_YP0301-4R7M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12463719.3 KB5页50
IC封装资料_电容_CL31C101JCCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121111.39 MB36页118
IC封装资料_电容_CL31B684KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B684KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215801.47 MB36页37
IC封装资料_电源管理芯片_NCP1271D65R2G.pdf
©SemiconductorComponentsIndustries,LLC,2009September,2009−Rev.61PublicationOrderNumber:NCP1271/DNCP1271Soft-Skip�ModeStandbyPWM...
2024-12-12134317.66 KB21页206
IC封装资料_连接器_A2541HWV-25P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121461815.29 KB16页36
IC封装资料_电容_CL10B224KB8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121901259.58 KB3页7
IC封装资料_电容_CL10B224KA8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12688259.58 KB3页202
IC封装资料_连接器_A2541HWV-24P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121040815.05 KB16页245
IC封装资料_连接器_A2541HWV-23P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121097814.78 KB16页97
IC封装资料_电容_0805N121J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125381.26 MB20页141
IC封装资料_电容_GRM1885C1HR75BA01D.pdf
GRM1885C1HR75BA01_(0603,C0G:EIA,0.75pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12124944.13 KB30页163
IC封装资料_电容_GRM1885C1HR70BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12990944.07 KB30页58
IC封装资料_电感_YP0301-100M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121110719.3 KB5页210
IC封装资料_电容_CL31F225ZOCNNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127317.46 MB84页182
IC封装资料_电源管理芯片_NCP5662DS33R4G.pdf
©SemiconductorComponentsIndustries,LLC,2013October,2019−Rev.161PublicationOrderNumber:NCP5662/DNCP5662,NCV5662LinearRegulator-Lo...
2024-12-121291734.24 KB15页270

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