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IC资料

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IC封装资料_电容_CL10B473KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B473KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,47㎋,50V,±1...
2024-12-121297228.45 KB2页198
IC封装资料_电容_1206B473K501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128271.05 MB27页115
IC封装资料_电感_YP1005-150M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121708776.32 KB5页233
IC封装资料_连接器_DF12B_3.0_-36DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12972288.67 KB11页135
IC封装资料_电容_1206B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211891.05 MB27页94
IC封装资料_电感_YP1005-221M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12741776.32 KB5页262
IC封装资料_连接器_DF12B_3.0_-32DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121706288.67 KB11页265
IC封装资料_连接器_DF12B_3.0_-32DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121100288.67 KB11页179
IC封装资料_电感_YP1005-151M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12556776.32 KB5页240
IC封装资料_连接器_DF12B_3.0_-30DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12474288.67 KB11页169
IC封装资料_电容_RVT1J470M0810-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1216221.08 MB3页141
IC封装资料_电源管理芯片_SPX3819M5-L-3-3_TR.pdf
SPX3819500mALow-NoiseLDOVoltageRegulatorJuly2018Rev.2.0.41/13Rev.2.0.4GENERALDESCRIPTIONTheSPX3819isapositivevoltageregulatorwitha...
2024-12-121821.15 MB13页254
IC封装资料_电容_RVT1J101M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126341.08 MB3页265
IC封装资料_连接器_DF12B_3.0_-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121420288.67 KB11页187
IC封装资料_电容_GRM188R71A684KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12842944.07 KB30页170
IC封装资料_连接器_DF12B_3.0_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121478288.67 KB11页144
IC封装资料_电容_CL10B473KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B473KC8WPNC●Product:Multi-layerCeramicCapacitorCAP,47㎋,100V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1217695.81 MB36页88
IC封装资料_连接器_DF12B_3.0_-36DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12548288.67 KB11页200
IC封装资料_电容_RVT1V100M0405-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-124071.08 MB3页171
IC封装资料_连接器_DF12B_3.0_-80DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121957288.67 KB11页47

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