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IC资料

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IC封装资料_电容_CL10B474KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B474KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12612361.09 KB3页107
IC封装资料_连接器_DF12E_3.0_-10DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121749288.67 KB11页28
IC封装资料_电容_ERZ1EM471F16OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12181715.39 MB230页216
IC封装资料_电容_CL10B474KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12708259.58 KB3页66
IC封装资料_电容_1206CG2R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122171.05 MB27页203
IC封装资料_电感_YPRH105R-100M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121628765.25 KB5页90
IC封装资料_电源管理芯片_TL431AIDBZRG4.pdf
VrefInputVKAIKAProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddre...
2024-12-1216202.94 MB84页129
IC封装资料_连接器_DF12E_3.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121077288.67 KB11页56
IC封装资料_电容_GRM188R71C474KA88D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12459944.07 KB30页173
IC封装资料_连接器_DF12E_3.0_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121010288.67 KB11页213
IC封装资料_连接器_DF12E_3.0_-32DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121303288.67 KB11页220
IC封装资料_电容_SPZ0JM331D08O00R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12122215.39 MB230页288
IC封装资料_电容_CL10B474KQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121108259.58 KB3页187
IC封装资料_电容_1206CG2R7C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210121.05 MB27页164
IC封装资料_电感_YPRH105R-102M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12791765.25 KB5页32
IC封装资料_电感_YPRH105R-101M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12443765.25 KB5页203
IC封装资料_连接器_1803293.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1250936.13 MB445页57
IC封装资料_电容_EVK105CH2R4JW-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12937653.27 KB26页75
IC封装资料_电容_EVK105CH1R5BW-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12605653.27 KB26页96
IC封装资料_连接器_DF12E_3.5_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12686288.67 KB11页260

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