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IC资料

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IC封装资料_电容_TAJC474M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121265210.32 KB7页251
IC封装资料_电容_TAJC157K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12327210.32 KB7页251
IC封装资料_连接器_1803361.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1211536.13 MB445页251
IC封装资料_电容_TAJB225M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12560210.32 KB7页251
IC封装资料_电容_1206CG3R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122761.05 MB27页251
IC封装资料_电容_CL10B182KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121808259.57 KB3页250
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250
IC封装资料_电容_0805F225Z250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126581.26 MB20页250
IC封装资料_数据转换器_AD5628BRUZ-2REEL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-121951.04 MB30页250
IC封装资料_三极管_WSR140N08.pdf
BVDSSRDSONID80V4.8mΩ140A�AdvancedhighcelldensityTrenchtechnology�SuperLowGateCharge�ExcellentCdV/dteffectdecline�100%EASGuara...
2024-12-121224852.18 KB7页250
IC封装资料_电容_GRM1555C1H7R0BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121127920.26 KB29页250
IC封装资料_电容_CL10B222KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B222KC8WPNC●Product:Multi-layerCeramicCapacitorCAP,2.2㎋,100V,±10%,X7R,0603●AEC-Q200Qual...
2024-12-123835.82 MB36页250
IC封装资料_电容_CL31A106KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A106KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12511.45 MB36页250
IC封装资料_三极管_TDM31035.pdf
November17,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®P-ChannelEnhancementModeMOSFETTDM31035DATASHEETDESCRIPTI...
2024-12-12954806.75 KB7页250
IC封装资料_三极管_TDM3205.pdf
July15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®P-ChannelEnhancementModeMOSFETTDM3205DATASHEETDESCRIPTIONThe...
2024-12-12441472.96 KB7页250
IC封装资料_电容_GRM1885C2A151JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12156944.07 KB30页250
IC封装资料_电容_GRM188R61A106KE69D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12285944.07 KB30页250
IC封装资料_电容_GRM188R72A471KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121610944.07 KB30页250
IC封装资料_连接器_1766165.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTB2,5/6-G-7,62OrderNo.:1766165Thefig...
2024-12-12358230.38 KB5页250
IC封装资料_电容_CL10C100DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121050259.57 KB3页250

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