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IC封装资料_电源管理芯片_LM2595S-ADJ_TR.pdf
SIMPLESWITCHER®PowerConverter150kHz1AStep-DownVoltageRegulatorGeneralDescriptionTheLM2595seriesofregulatorsaremonolithicintegrate...
2024-12-121004.47 MB23页240
IC封装资料_电感_NL453232T-100J-PF.pdf
INDUCTORSJanuary2015��NL4532324532[1812inch]**��JIS[EIA]��NL453232�NL��更多资料下载请到五八文...
2024-12-121523309.28 KB9页240
IC封装资料_电源管理芯片_LT1761ES5-BYP_TRMPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1212121.21 MB22页240
IC封装资料_电容_CL10B153KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12110361.71 KB3页239
IC封装资料_连接器_1-5103308-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121064190.54 KB1页239
IC封装资料_电容_GRM155R70J104KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12761920.26 KB29页239
IC封装资料_电容_CL10F474ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219441.42 MB36页239
IC封装资料_电容_C3225X5R1E106KTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129781.61 MB56页239
IC封装资料_电容_CL10B103KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121242361.14 KB3页239
IC封装资料_电容_CL10C361JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121455316.29 KB3页239
IC封装资料_电容_GRM155R60J224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121128920.26 KB29页239
IC封装资料_电容_CL10A106MPNNHBC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12741259.58 KB3页239
IC封装资料_电源管理芯片_LT4256-3IGN_PBF.pdf
LT4256-3142563faTheLT®4256-3isahighvoltageHotSwapTMcontrollerthatallowsaboardtobesafelyinsertedandremovedfromalivebackplane.Anint...
2024-12-121587327.72 KB20页239
IC封装资料_电感_NLCV32T-2R2M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12345249.79 KB16页239
IC封装资料_电源管理芯片_LT3027EMSE_TRPBF.pdf
1LT30273027faVOUT100µV/DIV20µVRMS3027TA01bAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUDual100mA,LowDropout,LowNoise,Micropo...
2024-12-12943403.76 KB16页239
IC封装资料_电容_CC1206JKNPOCBN330.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-122951.22 MB13页239
IC封装资料_电感_NLV32T-012J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12968224.35 KB10页239
IC封装资料_电容_0603B473K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219161.05 MB27页239
IC封装资料_电容_CC0603MRX5R5BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216011.22 MB13页239
IC封装资料_连接器_1755817.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1256836.13 MB445页239

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