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IC资料

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IC封装资料_电容_C2012X5R1E226MT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1219921.61 MB56页234
IC封装资料_电容_0603N470J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214221.26 MB20页234
IC封装资料_电容_GRM033R61A333KE84D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12165310.43 MB296页234
IC封装资料_电感_SDFL1005Q3R3KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121343457.75 KB7页234
IC封装资料_电容_0603CG103J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216571.05 MB27页234
IC封装资料_电感_NLV32T-120J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121259224.35 KB10页234
IC封装资料_电容_CC1206JRNPO9BN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-123521.22 MB13页234
IC封装资料_电容_0603B684K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121941.05 MB27页234
IC封装资料_电源管理芯片_LT1521IS8-5_TRPBF.pdf
1LT1521/LT1521-3LT1521-3.3/LT1521-51521335fbTheLT®1521/LT1521-3/LT1521-3.3/LT1521-5arelowdropoutregulatorswithmicropowerquiescent...
2024-12-12207288.43 KB16页234
IC封装资料_电源管理芯片_LT1461CIS8-4_PBF.pdf
LT146111461fbFormoreinformationwww.linear.com/LT1461TypicalapplicaTionFeaTuresDescripTionMicropowerPrecisionLowDropoutSeriesVoltag...
2024-12-126591.83 MB18页234
IC封装资料_电容_0402CG2R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219541.05 MB27页234
IC封装资料_电感_NLV25T-6R8J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12150316.78 KB6页234
IC封装资料_电容_CL21B472KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216337.46 MB84页233
IC封装资料_电源管理芯片_MC7815BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-121122296.53 KB31页233
IC封装资料_电容_CC0201JRNPO8BN270.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219221.22 MB13页233
IC封装资料_接口及驱动芯片_ISO1042BQDWVRQ1.pdf
1243765TXDVCC1RXDGND1CANHCANL8VCC2MCURXDTXDVDDDGNDDigitalGroundISOGroundCANBusGalvanicIsolationBarrierISO1042-Q1GND2VCC1VCC2Produc...
2024-12-127063.07 MB43页233
IC封装资料_电容_GRM155R61C225ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12568920.26 KB29页233
IC封装资料_电容_C1808V104KBRACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1034_X7R_HV_ARC_SMD•11/9/2018FortLauderdale,FL33301USA•954-7...
2024-12-126141.57 MB23页233
IC封装资料_电容_CL10A225KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123911.42 MB36页233
IC封装资料_电容_CL10A106MR5LQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121327259.58 KB3页233

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