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IC资料

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IC封装资料_电容_CL10C221JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C221JB81PNC●Product:Multi-layerCeramicCapacitorCAP,220㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1210415.8 MB36页217
IC封装资料_电容_TMK212BJ475KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121463653.27 KB26页217
IC封装资料_电容_TAJE227K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12698210.32 KB7页217
IC封装资料_电容_TAJE108K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121797210.32 KB7页217
IC封装资料_连接器_SM04B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12610661.07 KB4页217
IC封装资料_电容_TAJA225M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12461210.32 KB7页217
IC封装资料_电容_TAJA156K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-1255210.32 KB7页217
IC封装资料_电容_TAJA154M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12284210.32 KB7页217
IC封装资料_电源管理芯片_SDB628.pdf
628TheSDB1HighEfficiency1.2MHz2AStepUpConverterFEATURES•Integrated80mΩPowerMOSFET•2Vto24VInputVoltage•1.2MHzFixedSwitchingFreq...
2024-12-1219232.17 MB7页217
IC封装资料_电容_GRM188R60J106ME47D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121628944.07 KB30页217
IC封装资料_电源管理芯片_NCV33161DR2G.pdf
©SemiconductorComponentsIndustries,LLC,2015November,2015−Rev.131PublicationOrderNumber:MC34161/DMC34161,MC33161,NCV33161Universa...
2024-12-121307268.94 KB18页217
IC封装资料_电容_GRM1885C1H821JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121026944.07 KB30页217
IC封装资料_连接器_1888687.pdf
PHOENIXCONTACTInc.,USAPage1/6http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDSN2,5/2-5,08OrderNo.:1888687http://e...
2024-12-121934250.3 KB6页217
IC封装资料_电容_0805F224M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127151.05 MB27页217
IC封装资料_电容_GRM155R71E222KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12117920.26 KB29页217
IC封装资料_电容_CL10B105MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215211.45 MB36页217
IC封装资料_电容_0805CG9R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128591.05 MB27页217
IC封装资料_电感_NLCV32T-1R0M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12102249.79 KB16页217
IC封装资料_电容_GCM1885C1H270FA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214085.94 MB73页217
IC封装资料_电源管理芯片_LT3008ETS8-3.3_TRPBF.pdf
LT3008Series13008fcTEMPERATURE(°C)DROPOUTVOLTAGE(mV)QUIESCENTCURRENT(μA)4003008TA01b2001005005003002501505350231064504–50–2502...
2024-12-12362320.57 KB20页217

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