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IC资料

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IC封装资料_电感_YP0301-100M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121110719.3 KB5页210
IC封装资料_电容_CL21F225ZOFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1211017.46 MB84页210
IC封装资料_电容_GRM1885C1H391JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12996944.07 KB30页210
IC封装资料_电容_CL21C100DBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123731.45 MB36页210
IC封装资料_电容_CL10B152KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121630259.58 KB3页210
IC封装资料_电容_GRM1885C1H2R4BA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comForapplicationsthatdonotrequir...
2024-12-126404.37 MB90页210
IC封装资料_电感_YNR3010-470M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121524661.07 KB5页210
IC封装资料_电源管理芯片_LTM8022EV_PBF.pdf
LTM802218022fdFEATURESAPPLICATIONSDESCRIPTION1A,36VDC/DCµModuleTheLTM®8022isacomplete1A,DC/DCstep-downpowersupply.Includedinthep...
2024-12-12280359.48 KB20页210
IC封装资料_电容_CC0201KRX5R6BB223.pdf
DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSGeneralpurpose&HighcapacitanceClass2,X5R4VTO50V100pFto220µFRoHScompliant&Halogenf...
2024-12-12968921.74 KB19页210
IC封装资料_电容_CL10F333ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F333ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12844360.23 KB3页210
IC封装资料_电感_VLCF4020T-4R7N1R2.pdf
INDUCTORSApril2016��VLCF4020��VLCF4020�VLCF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/i...
2024-12-121680295.24 KB9页210
IC封装资料_电容_C1608X5R1E225K080AB.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-121241.65 MB57页210
IC封装资料_电容_GRM155R61A184KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121277920.26 KB29页210
IC封装资料_电感_SDFL2012T270KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12393457.75 KB7页210
IC封装资料_电源管理芯片_LTC3425EUH_TRPBF.pdf
LTC342513425fFEATURESAPPLICATIOSUDESCRIPTIOUIHandheldComputersIPoint-of-LoadRegulatorsI3.3Vto5VConversion,LTCandLTareregisteredtra...
2024-12-12507360.58 KB24页210
IC封装资料_电容_CC1206KKX7R9BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126421.22 MB13页210
IC封装资料_连接器_1733473.pdf
https://www.phoenixcontact.com/us/produkte/173347319.10.2012Page1/6PCBterminalblock-SMKDSP1,5/8-1733473Pleasebeinformedthatthedata...
2024-12-12884177.1 KB6页210
IC封装资料_电容_0603CG7R0D500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211161.05 MB27页210
IC封装资料_电容_CC1206JRNPO9BN680.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-122091.22 MB13页210
IC封装资料_电感_NLV32T-056J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121215325.01 KB6页210

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