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IC封装资料_电容_0402HQ150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127071.05 MB27页207
IC封装资料_电感_NLV32T-039J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121467224.35 KB10页207
IC封装资料_电容_0603B202K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210051.26 MB20页207
IC封装资料_电源管理芯片_L7812CD2T-TR.pdf
TO-220FPTO-220D²PAKDPAKFeatures•Outputcurrentupto1.5A•Outputvoltagesof5;6;8;8.5;9;12;15;18;24V•Thermaloverloadprotection•Shor...
2024-12-1216471.21 MB55页207
IC封装资料_连接器_1755752.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12188936.13 MB445页207
IC封装资料_电源管理芯片_LT1009CZ_TRPBF.pdf
LT1009Series11009ffTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION2.5VReferenceTheLT®1009isaprecisiontrimmed2.5Vshuntregula-tor...
2024-12-121599200.6 KB8页207
IC封装资料_电容_GRM155R71E473KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12249920.26 KB29页206
IC封装资料_电容_CC0402BRNPO9BN6R8.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217421.22 MB13页206
IC封装资料_电容_CL10B103KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1214515.82 MB36页206
IC封装资料_过压保护_PESD5V0S1BL.pdf
PESD5V0S1BLLowcapacitancebidirectionalESDprotectiondiode15May2018Productdatasheet1.GeneraldescriptionVerylowcapacitancebidirection...
2024-12-12112289.56 KB14页206
IC封装资料_电容_GRM1555C1H200JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121384920.26 KB29页206
IC封装资料_电容_GRM1555C1H150JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12160920.26 KB29页206
IC封装资料_连接器_1803510.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12184036.13 MB445页206
IC封装资料_电容_C0603C105K8PACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-121321.48 MB25页206
IC封装资料_电容_CL03A105MO3NRNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12537.46 MB84页206
IC封装资料_电源管理芯片_LTC3105EMS_TRPBF.pdf
LTC310513105fbFormoreinformationwww.linear.com/LTC3105TYPICALAPPLICATIONFEATURESDESCRIPTION400mAStep-UpDC/DCConverterwithMaximumPo...
2024-12-121598568.56 KB18页206
IC封装资料_电容_CC1812JKNPOCBN471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121719998.46 KB11页206
IC封装资料_电源管理芯片_LTC3415EUHF_TRPBF.pdf
LTC341513415faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION7A,PolyPhaseSynchronousStep-DownRegulatorTheLTC®3415isahighefficie...
2024-12-12485399.27 KB28页206
IC封装资料_连接器_1733428.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogSMKDSP1,5/3OrderNo.:1733428Th...
2024-12-121403228.56 KB6页206
IC封装资料_电感_MWSA1004-6R8MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121341319.07 KB8页206

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