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IC资料

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IC封装资料_三极管_DMN2004K-7.pdf
DMN2004KDocumentnumber:DS30938Rev.9-21of6www.diodes.comJuly2013©DiodesIncorporatedDMN2004KN-CHANNELENHANCEMENTMODEMOSFETProductSu...
2024-12-12424237.21 KB6页198
IC封装资料_电源管理芯片_UCC21520ADW.pdf
10911DriverVDDBOUTBVSSB1213NCNCUVLODEMODMOD151416DriverVDDAOUTAVSSAUVLODEMODMODFunctionalIsolationReinforcedIsolationDisable,UVLOa...
2024-12-126812.48 MB52页198
IC封装资料_三极管_CJ4153.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-523Plastic-EncapsulateMOSFETSCJ4153N-Channel20-V(D-S)MOSFETFEATURELowRDS(on)Imp...
2024-12-12814981.75 KB5页198
IC封装资料_三极管_C3M0075120K.pdf
1C3M0075120KRev.-,02-2017C3M0075120KSiliconCarbidePowerMOSFETC3MTMMOSFETTechnologyN-ChannelEnhancementModeFeatures•C3MTMSiCMOSFET...
2024-12-1219471.38 MB11页198
IC封装资料_电容_CL10C131JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12400259.57 KB3页198
IC封装资料_电容_CL10C122JB8NFNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121365452.9 KB21页198
IC封装资料_电容_CL10C121JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121775259.58 KB3页198
IC封装资料_电容_TAJC684K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12918210.32 KB7页198
IC封装资料_电容_CL10C4R7CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页198
IC封装资料_电感_YSPI0530-150M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12894698.99 KB4页198
IC封装资料_电感_YSPI0530-100M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121073698.99 KB4页198
IC封装资料_连接器_SM07B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12747661.14 KB4页198
IC封装资料_电容_GRM188R72A222KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1289944.07 KB30页198
IC封装资料_电容_CL10B473KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B473KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,47㎋,50V,±1...
2024-12-121297228.45 KB2页198
IC封装资料_连接器_DF12B_3.0_-20DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12884288.67 KB11页198
IC封装资料_连接器_BM28B0.6-36DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12232562.52 KB8页198
IC封装资料_电容_JDK105BJ106MV-FD.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12181653.27 KB26页198
IC封装资料_电容_CL10B225KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B225KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210381.45 MB36页198
IC封装资料_电容_CL32B106KAULNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32B106KAULNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129701.47 MB36页198
IC封装资料_电容_CL21C3R9CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210751.39 MB36页198

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