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IC封装资料_三极管_FQB33N10TM.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-129561.13 MB10页193
IC封装资料_电容_TMK107ABJ225KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12585857.12 KB55页193
IC封装资料_电容_TAJE686K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12517210.31 KB7页193
IC封装资料_电容_GRM188R71E103KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121189944.07 KB30页193
IC封装资料_连接器_DF12B_3.5_-60DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121338288.67 KB11页193
IC封装资料_电容_CL10B471KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12499452.9 KB21页193
IC封装资料_电容_LMK316BJ475ML-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-127481.83 MB52页193
IC封装资料_电容_CL21C4R7CBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123247.55 MB84页193
IC封装资料_电容_CC0402CRNPO9BN6R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121885998.46 KB11页193
IC封装资料_电源管理芯片_LTC6655BHMS8-5_TRPBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1215522.42 MB30页193
IC封装资料_电容_CL10F104ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F104ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213481.42 MB36页193
IC封装资料_电容_CL10CR82BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12402322.3 KB2页193
IC封装资料_电容_CL10C471JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121446259.58 KB3页193
IC封装资料_电容_GRM155R61A105ME15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121644920.26 KB29页193
IC封装资料_电阻_0603WAF100LT5E.pdf
DATASHEETProductNameThickFilmChipResistorsPartNameChipCommonSeries01005/0201/0402/0603/0805/1206/1210/1812/2010/2512UniroyalElectr...
2024-12-121094449.6 KB7页193
IC封装资料_电源管理芯片_LTC4012CUF_PBF.pdf
4012faLTC4012/LTC4012-1/LTC4012-2FeaturesapplicationsDescriptionHighEfficiency,Multi-ChemistryBatteryChargerwithPowerPathControlTh...
2024-12-121182469.26 KB28页193
IC封装资料_电源管理芯片_LTC4002ES8-4.2_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121694253.54 KB16页193
IC封装资料_电感_SWPA3015S120MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127211.32 MB22页193
IC封装资料_电感_SWPA6020S3R3NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212751.32 MB22页193
IC封装资料_电感_SWPA5012S3R3NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211551.32 MB22页193

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