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IC资料

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IC封装资料_电容_0805X475K250NT--2Kpcs.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210121.05 MB27页184
IC封装资料_连接器_AFC01-S33FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1211811.85 MB10页184
IC封装资料_电容_GRM1885C1HR60BA01D.pdf
GRM1885C1HR60BA01_(0603,C0G:EIA,0.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121642944.08 KB30页184
IC封装资料_电容_CL31B106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1210871.45 MB36页184
IC封装资料_电源管理芯片_MP2639AGR-P.pdf
MP2639A2-CellLi-IonorLi-PolymerSwitchingChargerCompatiblewith5VInputandIntegrated,BidirectionalCharge/DischargeMP2639ARev.1.0www.M...
2024-12-1217622.03 MB35页184
IC封装资料_电容_CL10B102MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121473360.81 KB3页184
IC封装资料_电容_CL10C820JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121042259.58 KB3页184
IC封装资料_电感_TFM201610GHM-2R2MTAA.pdf
August2017INDUCTORSThin-filmmetalTFM201610GHMInductorsforPowerCircuitsTFM201610GHMtypeTFM-GHMseries更多资料下载请到五八文库wk.58sm...
2024-12-12313261.65 KB9页184
IC封装资料_电容_C822J223J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1214012.9 MB5页184
IC封装资料_电源管理芯片_LTC3035EDDB_TRMPBF.pdf
LTC303513035f■WideInputVoltageRange:1.7Vto5.5V■WideAdjustableOutputVoltageRange:0.4Vto3.6V■Built-InChargePumpGeneratesHighSideB...
2024-12-121206290.37 KB12页184
IC封装资料_电感_SWPA3010S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122441.32 MB22页184
IC封装资料_电容_0805B106K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210961.05 MB27页184
IC封装资料_电感_SDFL1608LR12KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121619457.75 KB7页184
IC封装资料_电源管理芯片_LT8490EUKJ_PBF.pdf
LT849018490faFormoreinformationwww.linear.com/LT8490TypicalapplicaTionFeaTuresDescripTionHighVoltage,HighCurrentBuck-BoostBatteryC...
2024-12-121292773.85 KB42页184
IC封装资料_电容_CC1206KRX7R9BB124.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128031.22 MB13页184
IC封装资料_电容_CC1206KKX7RBBB472.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127181.22 MB13页184
IC封装资料_电感_NLV32T-082J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121387325.74 KB6页184
IC封装资料_电感_NLV25T-R39J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12862318.58 KB6页184
IC封装资料_电容_CC0805KRX7R9BB683.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214271.22 MB13页184
IC封装资料_连接器_1755794.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175736.13 MB445页184

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