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IC封装资料_电容_0201CG0R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213561.05 MB27页288
IC封装资料_电容_UPW1V471MPD.pdf
201ALUMINUMELECTROLYTICCAPACITORSCAT.8100FPerformanceCharacteristicsItemRatedvoltage(V)15MIN4MINφdU1P2W314A5668718M9P10D1112Confi...
2024-12-122571.61 MB5页288
IC封装资料_电容_0201HQ0R4B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210161.05 MB27页288
IC封装资料_电容_0201B561K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217831.05 MB27页288
IC封装资料_电容_0201CG680J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127601.05 MB27页288
IC封装资料_电容_GCM1555C1H5R6BA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-124605.94 MB73页288
IC封装资料_电源管理芯片_TPS23861PWR.pdf
RESETSHTDWNA3SCLSDAIAINAGNDDGNDKSENSxINTSDAOAOUTDRAINnGATEnVDDVPWRSENn22�100nF100V47�255m�Note:onlyportnshownTPS23861PORTn48V3....
2024-12-1215542.1 MB107页288
IC封装资料_电源管理芯片_SP809EK-L-2-9_TR.pdf
SSPP880099//SSPP88110033PPiinnMMiiccrroopprroocceessssoorrSSuuppeerrvviissoorrCCiirrccuuiittNovember2017Rev.2.0.21/8Rev.2.0.2GENER...
2024-12-121850769 KB8页288
IC封装资料_电容_TAJB336M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121892210.32 KB7页288
IC封装资料_连接器_BM28B0.6-6DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121641562.52 KB8页288
IC封装资料_连接器_FH12-16S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12691339.76 KB6页288
IC封装资料_连接器_1843350.pdf
https://www.phoenixcontact.com/us/products/184335010/28/2014Page1/5Basestrip-MCV1,5/15-GF-3,5-1843350Pleasebeinformedthatthedatash...
2024-12-121451172.53 KB5页288
IC封装资料_电容_CL10C100JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121939259.57 KB3页288
IC封装资料_连接器_1759156.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107936.13 MB445页288
IC封装资料_信号隔离芯片_FOD2712V.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121782670.43 KB14页288
IC封装资料_电源管理芯片_TPS73701DRVR.pdf
TPS737xxGNDENFBINOUTVINVOUTOptional1.0F�OFFONProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTPS737SBVS06...
2024-12-1210152.38 MB40页288
IC封装资料_电容_TAJD156M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12383210.32 KB7页288
IC封装资料_三极管_AO3401.pdf
P-ChannelEnhancementModeMOSFETFeature-30V/-4.2A,RDS(ON)=55mΩ(MAX)@VGS=RDS(ON)=70mΩ(MAX)@VGSRDS(ON)=120mΩ(MAX)@VGSSuperHighdense...
2024-12-12775542.21 KB3页288
IC封装资料_电容_GRM1885C2A680GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12323944.07 KB30页288
IC封装资料_电容_SPZ0JM331D08O00R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12122315.39 MB230页288

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