拖动LOGO至书签栏，立即收藏五八文库

首页
文档
中小学卷
语文试卷数学试卷英语试卷物理试卷化学试卷政治试卷历史试卷地理试卷生物试卷其他科目
教育资料
电商大学教学幼儿园小学初中高中
技能考试
公务员考试考研考博职业考证学历提升自学考试成人高考校园招聘普通话考试司法考试专业技能证书考试建筑工程考试外贸类考试医学护理类考试财会金融考试导游证考试社会工作者考试人力资源管理师考试心理咨询师考试教师招聘考试教师资格证计算机类考试全国翻译资格水平考试托福考试雅思口语考试专八英语考试专四英语考试大学英语四级大学英语六级公安类结构化面试公安专业国考省考军队文职考试银行招聘考试国考银保监会三支一扶考试事业单位考试公务员遴选公务员考试研究生考试港奥台华侨生联考体育单招考试
模板
安全生产财税公检法合同简历医疗总结汇报其他模板党政范文企业管理毕业答辩方案作文论文标准规范讲话稿
软件
常用软件量产开卡工具实用工具电路图固件施工图 IC资料
文章
问答
专题

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

IC资料

分类:

类型:

IC封装资料_信号隔离芯片_FOD2712R1V.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121707670.43 KB14页154
IC封装资料_三极管_CSD18543Q3A.pdf
VGS-Gate-to-SourceVoltage(V)RDS(on)-On-StateResistance(m:)02468101214161820036912151821242730D007TC=25°C,ID=12ATC=125°C,ID=12AQg...
2024-12-121932525.76 KB13页154
IC封装资料_电感_YSPI0750-2R2M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121595700.46 KB5页154
IC封装资料_电容_GRM188R72E102KW07D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12447944.07 KB30页154
IC封装资料_逻辑及时序器件_74LVC1G240DCKRE4.pdf
Seemechanicaldrawingsfordimensions.DBVPACKAGE(TOPVIEW)51VCCOE2A34GNDYDCKPACKAGE(TOPVIEW)2A34GNDVCC5OEY1YZPPACKAGE(BOTTOMVIEW)2AVCC...
2024-12-125362.2 MB29页154
IC封装资料_电容_TAJA475K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12758210.32 KB7页154
IC封装资料_连接器_KF127-5.0-6P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12486505.5 KB1页154
IC封装资料_连接器_KF124-3.5-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121625203.82 KB1页154
IC封装资料_电容_CL10B682JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121033259.58 KB3页154
IC封装资料_连接器_DF12B_3.0_-80DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12588288.67 KB11页154
IC封装资料_电容_1206B334K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213251.05 MB27页154
IC封装资料_连接器_ASP-134604-01.pdf
DONOTSCALEFROMTHISPRINT.040REF1.02.0441.12REF.0501.27REF.280REF7.11.2456.22(INCLUDESK-DOT).0501.27(TYP)1.950049.530(TYP)2.141REF54...
2024-12-121173868.76 KB4页154
IC封装资料_电容_1206B102K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121931.05 MB27页154
IC封装资料_电容_GRM1885C1H111JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12512944.07 KB30页154
IC封装资料_电容_0805CG270J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127661.05 MB27页154
IC封装资料_电容_CL10B104KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121120259.58 KB3页154
IC封装资料_电容_CL10C820GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121855316.18 KB3页154
IC封装资料_电容_GRM1555C1H220GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121928920.26 KB29页154
IC封装资料_电源管理芯片_LTC3114IDHC-1_PBF.pdf
LTC3114-11Rev.CFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTION40V,1ASynchronousBuck-BoostDC/...
2024-12-1211861.52 MB34页154
IC封装资料_电感_SWPA6028S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213831.32 MB22页154

首页上页 283 284 285 286 287 下页尾页

确认删除?