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IC资料

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IC封装资料_电容_GRM188R72E102KW07D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12447944.07 KB30页154
IC封装资料_逻辑及时序器件_74LVC1G240DCKRE4.pdf
Seemechanicaldrawingsfordimensions.DBVPACKAGE(TOPVIEW)51VCCOE2A34GNDYDCKPACKAGE(TOPVIEW)2A34GNDVCC5OEY1YZPPACKAGE(BOTTOMVIEW)2AVCC...
2024-12-125362.2 MB29页154
IC封装资料_电容_TAJA475K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12758210.32 KB7页154
IC封装资料_连接器_KF127-5.0-6P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12486505.5 KB1页154
IC封装资料_连接器_KF124-3.5-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121625203.82 KB1页154
IC封装资料_电容_CL10B682JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121033259.58 KB3页154
IC封装资料_连接器_DF12B_3.0_-80DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12588288.67 KB11页154
IC封装资料_电容_1206B334K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213251.05 MB27页154
IC封装资料_连接器_ASP-134604-01.pdf
DONOTSCALEFROMTHISPRINT.040REF1.02.0441.12REF.0501.27REF.280REF7.11.2456.22(INCLUDESK-DOT).0501.27(TYP)1.950049.530(TYP)2.141REF54...
2024-12-121173868.76 KB4页154
IC封装资料_电容_1206B102K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121931.05 MB27页154
IC封装资料_电容_GRM1885C1H111JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12512944.07 KB30页154
IC封装资料_电容_0805CG270J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127661.05 MB27页154
IC封装资料_电容_CL10B104KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121120259.58 KB3页154
IC封装资料_电容_CL10C820GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121855316.18 KB3页154
IC封装资料_电容_GRM1555C1H220GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121928920.26 KB29页154
IC封装资料_电源管理芯片_LTC3114IDHC-1_PBF.pdf
LTC3114-11Rev.CFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTION40V,1ASynchronousBuck-BoostDC/...
2024-12-1211861.52 MB34页154
IC封装资料_电感_SWPA6028S1R5MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213831.32 MB22页154
IC封装资料_电容_CGA2B1X7R1C104M050BC.pdf
SPECIFICATIONSPEC.No.A-General-fDATE:2017Aug.ToUpontheacceptanceofthisspec.previousspec.(C2005-1420)shallbeabolished.CUSTOMER’SPR...
2024-12-12522541.59 KB34页154
IC封装资料_电源管理芯片_LTC1778EGN_TRPBF.pdf
1LTC1778/LTC1778-11778fbWideOperatingRange,NoRSENSETMStep-DownController■NoSenseResistorRequired■TrueCurrentModeControl■Optimiz...
2024-12-12134350.29 KB24页154
IC封装资料_电容_0603X475M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12841.05 MB27页154

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