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IC封装资料_连接器_BM28B0.6-6DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12677562.52 KB8页150
IC封装资料_电容_0805X106K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124851.05 MB27页150
IC封装资料_电容_0805F476M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129161.05 MB27页150
IC封装资料_连接器_1935200.pdf
https://www.phoenixcontact.com/us/products/193520008/04/2015Page1/6PCBterminalblock-PT1,5/6-5,0-H-1935200Pleasebeinformedthattheda...
2024-12-121089172.21 KB6页150
IC封装资料_晶体管_ULN2003AJ.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1216231.39 MB35页150
IC封装资料_电容_0805B393K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218361.26 MB20页150
IC封装资料_电容_CL10C331JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121548316.28 KB3页150
IC封装资料_电容_CC1210KKX7RDBB222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12640998.46 KB11页150
IC封装资料_电感_NLV32T-330J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12835325.74 KB6页150
IC封装资料_电感_NLCV32T-1R0M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121875249.79 KB16页150
IC封装资料_电容_0402CGR75B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214321.05 MB27页150
IC封装资料_电容_CC0805KRX7R9BB563.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219971.22 MB13页150
IC封装资料_连接器_1755781.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1262336.13 MB445页150
IC封装资料_电容_GJM0335C1H3R9BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12117310.43 MB296页150
IC封装资料_电容_0402X475M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121481.05 MB27页150
IC封装资料_电容_GRM1885C1H131JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121083944.07 KB30页149
IC封装资料_电感_YNR4018-101M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121121661.38 KB5页149
IC封装资料_电源管理芯片_LTM4632EV_PBF.pdf
LTM46321Rev.DFormoreinformationwww.analog.comTYPICALAPPLICATIONFEATURESDESCRIPTIONUltrathin,TripleOutput,Step-DownµModuleRegulato...
2024-12-1215203.09 MB28页149
IC封装资料_电容_0805CG2R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125591.05 MB27页149
IC封装资料_电容_CL10C471JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121627259.57 KB3页149

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