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IC封装资料_电感_LQW15AN39NJ00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-121655376.63 KB15页140
IC封装资料_电容_CC0603GRNPO9BN561.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126661.22 MB13页140
IC封装资料_电源管理芯片_ADR441BRZ-REEL7.pdf
ADI��ADI��...
2024-12-12535633.03 KB20页140
IC封装资料_电感_LBR2012T220K.pdf
20REMINDERSNoticeforTAIYOYUDENproductsPleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.■ProductInformationinthisCatalogProduc...
2024-12-12142712.67 KB14页140
IC封装资料_数据转换器_AD5648BRUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1212281.04 MB30页140
IC封装资料_三极管_SQ2308CES-T1_GE3.pdf
SQ2308CESwww.vishay.comVishaySiliconixS14-0552-Rev.A,24-Mar-141DocumentNumber:63877Fortechnicalquestions,contact:automostechsuppor...
2024-12-12402357 KB10页140
IC封装资料_电容_C312G273J4SC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1216512.19 MB4页140
IC封装资料_三极管_IRFR9120NTRPBF.pdf
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2024-12-12386345.91 KB11页140
IC封装资料_三极管_DTC143ZETL.pdf
DTC143ZseriesNPN100mA50VDigitalTransistors(BiasResistorBuilt-inTransistors)DatasheetllOutlineParameterValueVMT3EMT3FVCC50VIC(MAX.)...
2024-12-1215213.77 MB12页140
IC封装资料_电容_TAJE106M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121241210.32 KB7页140
IC封装资料_电容_TAJC155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12775210.32 KB7页140
IC封装资料_电容_EXV107M035A9MAA.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardA4003_EXV•7/31/2019FortLauderdale,FL33301USA•954-766-2800•ww...
2024-12-1213084.06 MB19页140
IC封装资料_连接器_DF12B-32DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121847288.67 KB11页140
IC封装资料_电容_CC0402JRNPO9BN270.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12188417.81 MB176页140
IC封装资料_三极管_CJ2305.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-23Plastic-EncapsulateMOSFETSCJ2305P-ChannelMOSFETFEATURETrenchFETPowerMOSFETAPPLI...
2024-12-1211641.27 MB5页139
IC封装资料_三极管_AUIRF7484QTR.pdf
AUIRF7484QVDSS40VRDS(on)max.10mID14ADescriptionSpecificallydesignedforAutomotiveapplications,thisStripePlanardesignofHEXFET®P...
2024-12-121860500.94 KB11页139
IC封装资料_电容_TMK212BJ225KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121895857.12 KB55页139
IC封装资料_电容_TAJE337K006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121593210.32 KB7页139
IC封装资料_电容_TAJD157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121946210.32 KB7页139
IC封装资料_电容_CL10C6R8CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12160316.2 KB3页139

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