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IC资料

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IC封装资料_连接器_DF12E_3.5_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121883288.67 KB11页136
IC封装资料_连接器_DF12D_3.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12981288.67 KB11页136
IC封装资料_电容_RVT1H100M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126221.08 MB3页136
IC封装资料_电容_GRM188C71A475KE11D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12429944.07 KB30页136
IC封装资料_电容_CL10B224KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B224KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1217281.45 MB36页136
IC封装资料_电容_CL10B224KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12675259.57 KB3页136
IC封装资料_电容_GRM1885C1H562JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121424944.07 KB30页136
IC封装资料_电容_0805CG201J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123331.05 MB27页136
IC封装资料_电容_CL21A226KOQNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127297.55 MB84页136
IC封装资料_电容_CL10F223ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F223ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121336360.22 KB3页136
IC封装资料_电容_GRM1555C1H330JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121987920.26 KB29页136
IC封装资料_电感_SWPA252012S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127381.32 MB22页136
IC封装资料_电容_CL10A475KQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121413259.58 KB3页136
IC封装资料_电感_SWPA8040S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211571.32 MB22页136
IC封装资料_电容_GRM155R60J155ME80D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R60J155ME80_(0402,X5R(EIA),1.5uF,DC6.3V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121600899.99 KB30页136
IC封装资料_电感_SDCL1608C18NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121783376.19 KB4页136
IC封装资料_电感_NLV32T-8R2J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121204325 KB6页136
IC封装资料_电感_NLV25T-R22J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121688316.79 KB6页136
IC封装资料_电源管理芯片_LM431BIM3X_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLM431SNVS020H–MAY2000–REVISEDJANUARY2016LM431AdjustableP...
2024-12-122691.84 MB38页136
IC封装资料_电源管理芯片_HX7050A _SOT-89.pdf
Ver2.11HX70XX系列低电压检测器■产品简介系列是一款采用CMOS技术实现的三端口低电压检测器。该系列检测器能检测2.2V~7V的固定电压，检测器...
2024-12-1212161.5 MB8页136

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