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IC资料

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IC封装资料_电源管理芯片_MP2162.pdf
MP21622A,6V,1.5MHz,17μAIQ,COTSynchronousStepDwonSwitcherInUltra-small2x1.5mmQFNMP2162Rev.1.01www.MonolihicPower.com111/12/2013MPS...
2024-12-121495540.18 KB13页131
IC封装资料_电容_CL10B222KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121048361.48 KB3页131
IC封装资料_电感_YNR6045-2R2M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12359672.55 KB6页131
IC封装资料_连接器_1844265.pdf
https://www.phoenixcontact.com/us/products/184426504/26/2016Page1/10Basestrip-MC1,5/7-G-3,5-1844265Pleasebeinformedthatthedatashow...
2024-12-12576354.84 KB11页131
IC封装资料_微控制器_MC96F8208SRBN.pdf
CMOSsingle-chip8-bitMCUwith12-bitA/DconverterMC96F8208SDataSheetMainfeatures8-bitMicrocontrollerWithHighSpeed8051CPUBasicMCUFu...
2024-12-1211941.26 MB43页130
IC封装资料_电容_CL10C220JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121749316.29 KB3页130
IC封装资料_电容_C222J334K60F350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1213631.98 MB5页130
IC封装资料_三极管_BCV47_215.pdf
DATASHEETProductdatasheetSupersedesdataof1999Apr082004Jan13DISCRETESEMICONDUCTORSBCV27;BCV47NPNDarlingtontransistors更多资料下载请...
2024-12-121675183.08 KB7页130
IC封装资料_电源管理芯片_TPS65217CRSLR.pdf
DDR3orDDR3LMemoryVTT,VREFCAVACACadapterDC5-Vout1.5Vor1.35V1.1V1.1V1.8VVDDQ/2TPS65217C,TPS65217DPMICDCDC1DCDC2DCDC31.2A1.2A1.2ALDO1...
2024-12-1219412.12 MB92页130
IC封装资料_电容_TAJE157K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121166210.32 KB7页130
IC封装资料_电容_CL10C090CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12169259.58 KB3页130
IC封装资料_电源管理芯片_TPS61160ADRVR.pdf
C138VMAXVINSWFBGNDCTRLCOMPC220mATPS61161AON/OFFDIMMINGCONTROLV3Vto18VIL122H�1F�C3220nFR10set�1F�L1:TDKVLCF5020T-220MR75-1C1:Mu...
2024-12-1219792.6 MB35页130
IC封装资料_电容_GCJ188R71E103KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1218445.94 MB73页130
IC封装资料_电容_CL10C2R5CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12904316.19 KB3页130
IC封装资料_连接器_KF141V-2.54-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12976672.18 KB1页130
IC封装资料_连接器_KF2EDGCR-X-5.0-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12508620.86 KB1页130
IC封装资料_连接器_FH28-40S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12569492.73 KB12页130
IC封装资料_电容_T491A105K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-122841.54 MB23页130
IC封装资料_电容_CL10B474KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121882259.58 KB3页130
IC封装资料_连接器_DF12B_4.0_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121466288.67 KB11页130

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