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IC资料

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IC封装资料_电容_GCJ21BR71H105KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-121054.17 MB96页126
IC封装资料_电容_F971C106MAA.pdf
108071119F97SeriesResin-MoldedChip,ImprovedReliabilityJ-LeadLEAD-FREECOMPATIBLECOMPONENTLHSW1W2SLHSW1W2SA,BCASEC,NCASEF97Type1CRat...
2024-12-121025334.34 KB5页126
IC封装资料_电容_GRM188R71C274KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121251944.07 KB30页126
IC封装资料_连接器_DF3A-15P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121210222.32 KB1页126
IC封装资料_电容_EMVE250ADA221MHA0G.pdf
SURFACEMOUNTALUMINUMELECTROLYTICCAPACITORSDownsized,105CCAT.No.E1001E@Ratedvoltagerange:6.3to450V,capacitancerange:0.47to6800MF@En...
2024-12-12544146.92 KB2页126
IC封装资料_电容_1206B222K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212021.05 MB27页126
IC封装资料_电容_EMK107B7105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12738857.12 KB55页126
IC封装资料_电容_1206B181K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210351.05 MB27页126
IC封装资料_电容_GRM1885C2A300JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121359944.07 KB30页126
IC封装资料_电容_GRM1885C2A270JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121513944.07 KB30页126
IC封装资料_电源管理芯片_MP2145GD-Z.pdf
MP21455.5V,6A,1.2MHz,High-Efficiency,40μAIQConstantOn-TimeSynchronous,Step-DownSwitcherMP2145Rev.1.12www.MonolithicPower.com111/2...
2024-12-129031.01 MB19页126
IC封装资料_电容_CL21F105ZBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214071.46 MB36页126
IC封装资料_电容_GRM1885C1H3R6BA01D.pdf
GRM1885C1H3R6BA01_(0603,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12959944.1 KB30页126
IC封装资料_电容_CL19A226MR7NWN8.pdf
05031更多资料下载请到五八文库wk.58sms.com2
2024-12-121817484.4 KB2页126
IC封装资料_电容_GRM1555C1HR20BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121526920.26 KB29页126
IC封装资料_电容_CL10B103KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121604259.58 KB3页126
IC封装资料_电源管理芯片_LTC4413EDD_PBF.pdf
LTC441314413fdFormoreinformationwww.linear.com/LTC4413TypicalapplicaTionDescripTionDual2.6A,2.5Vto5.5V,IdealDiodesin3mm×3mmDFNThe...
2024-12-12231303.15 KB14页126
IC封装资料_电源管理芯片_LTC4009IUF-1_PBF.pdf
4009fdLTC4009LTC4009-1/LTC4009-2TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Multi-ChemistryBatteryChargerTheLT...
2024-12-12597439.45 KB28页126
IC封装资料_电容_CL10C300FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12585316.18 KB3页126
IC封装资料_电容_CL10A225KO8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123841.45 MB36页126

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