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IC资料

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IC封装资料_电容_GCJ188C70J475KE02D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-121495.94 MB73页99
IC封装资料_电容_1206CG222J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215481.05 MB27页99
IC封装资料_电容_RVT1V330M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-122611.08 MB3页99
IC封装资料_连接器_DF12B_4.0_-30DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12308288.67 KB11页99
IC封装资料_电容_ERJ1HM221G16OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12157315.39 MB230页99
IC封装资料_电容_CL10B334KA84PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121614452.9 KB21页99
IC封装资料_电容_CL10B332KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12225259.57 KB3页99
IC封装资料_连接器_1844252.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/6-G-3,5OrderNo.:1844252...
2024-12-121192246.86 KB5页99
IC封装资料_连接器_1830732.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12166136.13 MB445页99
IC封装资料_电容_CL10B153KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12167452.9 KB21页99
IC封装资料_电容_GRM1885C1H101GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12480944.07 KB30页99
IC封装资料_电源管理芯片_MAX40200AUK+T.pdf
GeneralDescriptionTheMAX40200isanidealdiodecurrent-switchthatdropssolittlevoltagethatitapproachesanorderofmagnitudebetterthanSchot...
2024-12-121845646.27 KB14页99
IC封装资料_电容_CL10F224ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122961.42 MB36页99
IC封装资料_接口及驱动芯片_NXB0104GU12X.pdf
NXB0104Dualsupplytranslatingtransceiver;autodirectionsensing;3-stateRev.1—11September2019Productdatasheet1.GeneraldescriptionTheN...
2024-12-12470422.18 KB25页99
IC封装资料_电容_GRM1555C1H471FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12627920.26 KB29页99
IC封装资料_电阻_WA04X220JTL.pdf
ApprovalsheetPage1of9ASC_WA04/06_V15Oct.2010WA04,WA06±±±±1%,±±±±5%,ConvexType&ConcaveTypeGeneralpurposechipresistorsarrayS...
2024-12-121715678.52 KB9页99
IC封装资料_电容_CL10C560JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215201.39 MB36页99
IC封装资料_电容_CL10A475MA8NQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12872259.58 KB3页99
IC封装资料_电容_CL10A226MR8NQNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A226MR8NQNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218861.48 MB36页99
IC封装资料_电容_0603N180J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218981.26 MB20页99

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