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IC资料

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IC封装资料_连接器_AYF530535.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1219521.1 MB13页91
IC封装资料_电感_YP0403-470M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121132776.45 KB5页91
IC封装资料_电容_GRT188R61A226ME13D.pdf
GRT188R61A226ME13_(0603,X5R:EIA,22uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121928958.76 KB30页91
IC封装资料_电容_CC0402KPX7R9BB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219601.22 MB13页91
IC封装资料_电容_CL10B331KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12824259.58 KB3页91
IC封装资料_电容_CL10B331KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121016259.58 KB3页91
IC封装资料_电容_CL31B225KCHSNNE.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL31B225KCHSNNEProduct:Multi-layerCeramicCapacitor...
2024-12-125381.43 MB36页91
IC封装资料_连接器_A2001WV-S-4P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121434404 KB6页91
IC封装资料_电源管理芯片_MAX17225ELT+T.pdf
GeneralDescriptionTheMAX17220–MAX17225isafamilyofultra-lowquiescentcurrentboost(step-up)DC-DCconverterswitha225mA/0.5A/1Apeakindu...
2024-12-121891992.67 KB23页91
IC封装资料_连接器_1830664.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-128236.13 MB445页91
IC封装资料_电容_CC0201KRX7R9BB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128801.22 MB13页91
IC封装资料_电容_CL10B103KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121322259.58 KB3页91
IC封装资料_电源管理芯片_LM25088MHX-2_NOPB.pdf
BOOTSWCOMPFBRAMPDITH/RESVCCVINOUTCSCSGVOUTENHGGNDLDRsQCDITHER/RESTARTCINCVCCCSSCRAMPRRAMPRRTRCOMPCCOMPCHFCOUT1COUT2RFB2RFB1CBOOTRU...
2024-12-1214271.53 MB41页91
IC封装资料_电感_NLCV32T-6R8M-PFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12866249.79 KB16页91
IC封装资料_电源管理芯片_LT3505EDD_TRPBF.pdf
LT350513505fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.2A,Step-DownSwitchingRegulatorin3mm×3mmDFNTheLT®3505isacurrentmo...
2024-12-121039896.8 KB24页91
IC封装资料_电容_0603B331K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217301.05 MB27页91
IC封装资料_电容_CC0805KKX5R7BB106.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128781.22 MB13页91
IC封装资料_电容_CC0805JRX7R9BB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215281.22 MB13页91
IC封装资料_电容_0402X223K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125131.05 MB27页91
IC封装资料_电容_CC0805JRNPOBBN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127191.22 MB13页91

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