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IC资料

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IC封装资料_电容_TAJA155K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121601210.32 KB7页84
IC封装资料_电容_T491A475K025AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-125111.47 MB23页84
IC封装资料_电容_GRM188R71C104JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121862944.07 KB30页84
IC封装资料_连接器_BM28B0.6-10DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121647562.52 KB8页84
IC封装资料_连接器_AFC01-S48FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-121101.85 MB10页84
IC封装资料_电容_GRT31CR61H106ME01L.pdf
GRT31CR61H106ME01_(1206,X5R:EIA,10uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121673958.76 KB30页84
IC封装资料_电容_CC0402JRX7R9BB221.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1218871.61 MB20页84
IC封装资料_电容_GRM1885C1H9R0BA01D.pdf
GRM1885C1H9R0BA01_(0603,C0G:EIA,9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12219944.09 KB30页84
IC封装资料_电源管理芯片_MC78M05BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2016March,2016−Rev.281PublicationOrderNumber:MC78M00/DMC78M00,MC78M00A,NCV78M00Series500m...
2024-12-121006222.17 KB15页84
IC封装资料_电容_CL21B106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1212421.42 MB36页84
IC封装资料_电阻_RLP25FEER003.pdf
HighPowerCurrentSensingResistorsRLPSeries(Halogen-Free)AEC-Q200-VerDqualifiedDocumentNoTRLP-250S008FIssueddate2016/10/11page1/6TA-...
2024-12-12114530.31 KB6页84
IC封装资料_电容_GRM1555C1H120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12233920.26 KB29页84
IC封装资料_电容_CL10C360JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121789316.3 KB3页84
IC封装资料_电容_CL10A335KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12724259.58 KB3页84
IC封装资料_电感_SWPA5020S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217631.32 MB22页84
IC封装资料_电容_CL03C220JA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127457.46 MB84页84
IC封装资料_电容_0603X225K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215031.26 MB20页84
IC封装资料_电容_0603CG120J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213971.05 MB27页84
IC封装资料_电容_0402F104Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128001.26 MB20页84
IC封装资料_电容_CC0805ZRY5V9BB474.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12695998.46 KB11页84

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