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IC封装资料_电容_TAJC226M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12850210.32 KB7页70
IC封装资料_电容_GRM0335C1E470JA01D.pdf
(PartNumber)1ProductID2SeriesChipMultilayerCeramicCapacitorsforGeneralGAGCGJGMGQGRGXKRLLZR23H4MADM34JMM3MALMRABBasedontheElectrica...
2024-12-12616143.95 KB4页70
IC封装资料_连接器_1803358.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1236736.13 MB445页70
IC封装资料_连接器_KF170V-5.0-15P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121323207.6 KB1页70
IC封装资料_电容_T490B337M006ATE800.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-124961.54 MB23页70
IC封装资料_电感_YPRH0704-3R3M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-12867730.34 KB5页70
IC封装资料_电容_GRM188R71E105KA12D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12422944.07 KB30页70
IC封装资料_电容_FC0H224ZFTBR24.pdf
1©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comS6011_FC•3/29/2017Oneworld.OneKEMETBe...
2024-12-121807867.01 KB16页70
IC封装资料_电源管理芯片_TL431BCDBZRVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12743278.43 KB28页70
IC封装资料_电感_YPRH105R-2R2M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12389765.25 KB5页70
IC封装资料_连接器_DF12B-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121417288.67 KB11页70
IC封装资料_电容_GRM188R61E224KA88D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12853944.07 KB30页70
IC封装资料_电容_CC0402BRNPO9BN8R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217861.22 MB13页70
IC封装资料_电容_GRM1885C1H1R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121360944.07 KB30页70
IC封装资料_电容_CC0201KRX5R6BB473.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12515998.46 KB11页70
IC封装资料_电容_CC0201CRNPO9BN4R7.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215261.22 MB13页70
IC封装资料_电感_WPN4020H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12838624.92 KB9页70
IC封装资料_电容_C0603X7R221KGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1218011.92 MB48页70
IC封装资料_电感_SPM6530T-3R3M.pdf
INDUCTORSMay2016WoundMetalSPM6530InductorsforPowerCircuitsSPM6530TypeSPMSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20...
2024-12-12242207.88 KB9页70
IC封装资料_电感_SDFL2012LR18KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12538457.75 KB7页70

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