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IC资料

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IC封装资料_电容_GRM1555C1H100GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12234920.26 KB29页63
IC封装资料_电源管理芯片_LTC1871EMS_PBF.pdf
LTC187111871feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONWideInputRange,NoRSENSE™CurrentModeBoost,FlybackandSEPICController...
2024-12-121080602.47 KB36页63
IC封装资料_电容_CL05B104KB5NFNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215067.46 MB84页63
IC封装资料_电感_NLV32T-330J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12447224.35 KB10页63
IC封装资料_电容_GJM1555C1H4R3WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12144310.43 MB296页63
IC封装资料_电容_CC1206JRNPO9BN222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12175998.46 KB11页63
IC封装资料_连接器_1755862.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1218836.13 MB445页63
IC封装资料_电感_NLCV25T-2R2M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121978249.79 KB16页63
IC封装资料_电容_0603B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122791.05 MB27页63
IC封装资料_电容_CC0603ZRY5V8BB104.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-127911.08 MB13页63
IC封装资料_电源管理芯片_LM1117MP-3.3_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-1210192.88 MB40页63
IC封装资料_电容_0402CG100G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219981.05 MB27页63
IC封装资料_电感_MLG1005S8N2JT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121416420.58 KB16页63
IC封装资料_电源管理芯片_LT1129CQ-3.3_TRPBF.pdf
LT1129/LT1129-3.3/LT1129-51112935ffTYPICALAPPLICATIONDESCRIPTIONMicropowerLowDropoutRegulatorswithShutdownTheLT®1129/LT1129-3.3/L...
2024-12-121081259.63 KB16页63
IC封装资料_电源管理芯片_MCP73831T-2ACI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-12145915.63 KB28页62
IC封装资料_电容_CL21B334KBFNFNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12867.46 MB84页62
IC封装资料_电容_CL10B105KO8SFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8SFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215591.45 MB36页62
IC封装资料_电容_0805CG220J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214631.05 MB27页62
IC封装资料_电容_CL10B104KC8VPNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121287.55 MB84页62
IC封装资料_电源管理芯片_LTC4011CFE_PBF.pdf
LTC40114011fbTypicalapplicaTionFeaTuresDescripTionHighEfficiencyStandaloneNickelBatteryChargerapplicaTionsnCompleteNiMH/NiCdCharge...
2024-12-121071741.61 KB26页62

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