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IC资料

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IC封装资料_三极管_DMP3007SCG-7.pdf
DMP3007SCGDocumentnumber:DS38990Rev.3-21of7www.diodes.comSeptember2016©DiodesIncorporatedDMP3007SCGADVANCEINFORMATION30VP-CHANNEL...
2024-12-12265531.9 KB7页53
IC封装资料_电容_CL10C020CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12670340 KB3页53
IC封装资料_电源管理芯片_TPS53015DGSR.pdf
VFBPGTPS53015VREG5EN1234VIN5109876VBSTDRVHSWDRVLPNGDPGENVINVINVOUTCopyright©2016,TexasInstrumentsIncorporatedProductFolderOrderNo...
2024-12-128981.27 MB30页53
IC封装资料_电容_TAJA155K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121386210.32 KB7页53
IC封装资料_电源管理芯片_TLV1117-33IDCYR.pdf
TLV1117-ADJOUTPUTADJ/GNDINPUTProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV1117SLVS561L–DECEMBER2004...
2024-12-123481.68 MB40页53
IC封装资料_连接器_F0502-B-30-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12714290.85 KB1页53
IC封装资料_电容_GRM188R71E104JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12255944.07 KB30页53
IC封装资料_电感_YPRH105R-150M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12491765.25 KB5页53
IC封装资料_连接器_DF12E_3.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12681288.67 KB11页53
IC封装资料_电感_YP0705-471M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12672721.48 KB5页53
IC封装资料_连接器_1766204.pdf
https://www.phoenixcontact.com/us/products/176620410/24/2014Page1/5Basestrip-GMSTB2,5/10-G-7,62-1766204Pleasebeinformedthatthedata...
2024-12-121697169.01 KB5页53
IC封装资料_电容_CL10B332MB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121779259.58 KB3页53
IC封装资料_连接器_1881464.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/4-G-2,5OrderNo.:1881464...
2024-12-12982251.47 KB5页53
IC封装资料_微控制器_Z8523L08VEG.pdf
Copyright©2015byZilog®,Inc.Allrightsreserved.www.zilog.comProductSpecificationPS005309-0515Z80230/Z85230/LEnhancedSerialCommunic...
2024-12-121531021.79 KB118页52
IC封装资料_电容_AC1206JKNPOZBN102.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-122681.06 MB24页52
IC封装资料_电源管理芯片_UC3842BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013September,2013−Rev.171PublicationOrderNumber:UC3842B/DUC3842B,UC3843B,UC2842B,UC2843B...
2024-12-12231493.32 KB22页52
IC封装资料_电容_GRM1555C1E180JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121231920.26 KB29页52
IC封装资料_电容_TAJC685K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12812210.32 KB7页52
IC封装资料_电容_CL10C3R9CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121014316.22 KB3页52
IC封装资料_电容_1206F225M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218811.05 MB27页52

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