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IC资料

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IC封装资料_电容_CC0603KRX5R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1211321.22 MB13页48
IC封装资料_电容_GCM188R72A102KA37D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1219603.23 MB2页48
IC封装资料_电容_GCM188R71H104KA57D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1212233.23 MB2页48
IC封装资料_电容_0201X222K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123441.05 MB27页48
IC封装资料_电源管理芯片_AP3032KTR-G1.pdf
DataSheetWHITELEDSTEP-UPCONVERTERAP3032Dec.2012Rev.1.2BCDSemiconductorManufacturingLimited1GeneralDescriptionTheAP3032isaninductor...
2024-12-121125565.41 KB13页48
IC封装资料_电容_CC0603GRNPO9BN100.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121256998.46 KB11页48
IC封装资料_电容_0201CG4R7B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216541.05 MB27页48
IC封装资料_电容_0201CG0R8B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122071.05 MB27页48
IC封装资料_连接器_9631S-32Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121055204.61 KB1页48
IC封装资料_电容_UCS2G820MHD.pdf
252ALUMINUMELECTROLYTICCAPACITORSCAT.8100HUCSMiniatureSized,HighRippleCurrent,HighReliabilityHighripplecurrentandLongLifeproductwi...
2024-12-12686781.44 KB2页48
IC封装资料_电容_TAJD157K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121045210.32 KB7页48
IC封装资料_电容_TAJC227M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121524210.32 KB7页48
IC封装资料_电容_TAJB157M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12859210.32 KB7页48
IC封装资料_电容_T491D476K025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1212151.54 MB23页48
IC封装资料_电容_EMK316BJ226KL-T.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12179810.43 MB296页48
IC封装资料_电容_QMK325BJ154KN-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121954857.12 KB55页48
IC封装资料_连接器_AFC01-S35H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-124781.58 MB1页48
IC封装资料_电容_GRM1885C2A391JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12270944.07 KB30页48
IC封装资料_连接器_AFC01-S07FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-125441.85 MB10页48
IC封装资料_电容_CL31A106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213661.45 MB36页48

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