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IC资料

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IC封装资料_电容_QMK325BJ154KN-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121954857.12 KB55页48
IC封装资料_连接器_AFC01-S35H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-124781.58 MB1页48
IC封装资料_电容_GRM1885C2A391JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12270944.07 KB30页48
IC封装资料_连接器_AFC01-S07FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-125441.85 MB10页48
IC封装资料_电容_CL31A106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213661.45 MB36页48
IC封装资料_电源管理芯片_MP2143DJ-LF-Z.pdf
MP21433A,5.5V,1.2MHz,40μAIQ,COTSynchronousStepDownSwitcherMP2143Rev.1.07www.MonolithicPower.com17/4/2016MPSProprietaryInformation...
2024-12-12572564.87 KB14页48
IC封装资料_电感_YNR5020-4R7M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12194664.7 KB5页48
IC封装资料_电容_GRM1885C1H6R0CA01D.pdf
GRM1885C1H6R0CA01_(0603,C0G:EIA,6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121617944.1 KB30页48
IC封装资料_电容_CL10B104MA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121811259.58 KB3页48
IC封装资料_电感_WPN201610U2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121253624.92 KB9页48
IC封装资料_电容_C1608C0G1H682J080AA.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129811.67 MB57页48
IC封装资料_电容_C0603C102K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-123061.48 MB25页48
IC封装资料_电容_CL10A225KQ5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213521.45 MB36页48
IC封装资料_电容_CL10A224KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121749259.58 KB3页48
IC封装资料_连接器_1757365.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1265336.13 MB445页48
IC封装资料_电源管理芯片_LTC1773EMS_TRPBF.pdf
LTC177311773fbAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOU■HighEfficiency:Upto95%■ConstantFrequency550kHzOperation■VINfrom...
2024-12-12335359.75 KB20页48
IC封装资料_电容_GJM1555C1HR40BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12127810.43 MB296页48
IC封装资料_连接器_1753479.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBV2,5/4-GOrderNo.:1753479T...
2024-12-12382230.13 KB5页48
IC封装资料_连接器_1751329.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/10-3,5OrderNo.:1751329Thefiguresh...
2024-12-12224226.53 KB5页48
IC封装资料_连接器_1751293.pdf
https://www.phoenixcontact.com/us/produkte/175129326.10.2012Page1/6PCBterminalblock-MKDS1/7-3,5-1751293Pleasebeinformedthatthedata...
2024-12-121872175.58 KB6页48

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