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IC资料

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IC封装资料_电容_CL10C560JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12711259.58 KB3页298
IC封装资料_电容_CL10F104ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页298
IC封装资料_电源管理芯片_LTC4415EMSE_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121590435.08 KB20页298
IC封装资料_电容_CL10F334ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F334ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.42 MB36页298
IC封装资料_电容_0805CG3R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127931.05 MB27页298
IC封装资料_电容_GRM1885C1H270FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12822944.07 KB30页298
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121121814.66 KB16页298
IC封装资料_连接器_AFC01-S05FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-12641.85 MB10页298
IC封装资料_电容_GRM188F51H104ZA01D.pdf
GRM188F51H104ZA01_(0603,Y5V,0.1uF,50Vdc)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)4....
2024-12-12593846.35 KB29页298
IC封装资料_电容_CC0402KRX5R5BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219731.22 MB13页298
IC封装资料_连接器_AFC11-S08ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-128581.4 MB10页298
IC封装资料_电源管理芯片_SPX3819M5-L_TR.pdf
SPX3819500mALow-NoiseLDOVoltageRegulatorJuly2018Rev.2.0.41/13Rev.2.0.4GENERALDESCRIPTIONTheSPX3819isapositivevoltageregulatorwitha...
2024-12-122911.15 MB13页298
IC封装资料_电源管理芯片_TLV62569DBVR.pdf
Load(A)Efficiency(%)00.20.40.60.811.21.41.61.826065707580859095100D008VOUT=1.2VVOUT=1.8VVOUT=2.5VVOUT=3.3VR1200k�R2100k�SWGNDFBE...
2024-12-125371.8 MB29页298
IC封装资料_电容_T491C227K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1217461.54 MB23页298
IC封装资料_电容_1206CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126781.05 MB27页298
IC封装资料_连接器_KF170V-5.0-14P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121412207.6 KB1页298
IC封装资料_连接器_KH-IPEX-K501-29.pdf
丁济松NEWRELEASE曾庆勇熊智由Autodesk教育版产品制作由Autodesk教育版产品制作由Autodesk教育版产品制作由Autodesk教育版产品制作深圳市金...
2024-12-121153301.76 KB1页298
IC封装资料_电容_TAJC685K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121476210.32 KB7页298
IC封装资料_电容_1812B223K501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126331.05 MB27页298
IC封装资料_电容_TC212A106K010Y.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-12215350.17 KB10页298

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