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IC资料

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IC封装资料_电感_NLCV25T-R68M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121212249.79 KB16页273
IC封装资料_电容_GJM1555C1H4R0BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12102410.43 MB296页273
IC封装资料_电容_CL21B104KACNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126051.45 MB36页273
IC封装资料_电源管理芯片_LTC4001EUF_PBF.pdf
1LTC40014001f■HandheldBattery-PoweredDevices■HandheldComputers■ChargingDocksandCradles■DigitalCameras■SmartPhones2ASingleCell...
2024-12-121662308.83 KB20页273
IC封装资料_电源管理芯片_LT3055EMSE_TRPBF.pdf
LT3055Series1Rev.BFormoreinformationwww.analog.comTYPICALAPPLICATIONFEATURESDESCRIPTION500mA,LinearRegulatorwithPrecisionCurrentLi...
2024-12-1212942.23 MB26页273
IC封装资料_电容_CL10C331JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121049259.57 KB3页273
IC封装资料_电容_GRM155R61H104KE14D.pdf
GRM155R61H104KE14_(0402,X5R:EIA,0.1uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121140924.63 KB29页273
IC封装资料_电容_CC0201DRNPO9BN8R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121880998.46 KB11页273
IC封装资料_电容_CL10C470JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121599259.58 KB3页273
IC封装资料_电容_CGA5L3X8R1H105K160AB.pdf
April2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA21005[0402inch]CGA31608[0603inch]CGA42012[0805inch]CGA53...
2024-12-12783724.43 KB16页273
IC封装资料_电容_0603B272K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214781.26 MB20页273
IC封装资料_电感_NLV25T-4R7J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12566316.79 KB6页273
IC封装资料_电容_0805CG500J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128641.05 MB27页273
IC封装资料_电容_GRM155R61C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12685920.26 KB29页273
IC封装资料_电源管理芯片_LT3085IMS8E_PBF.pdf
LT308513085fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONAdjustable500mASingleResistorLowDropoutRegulatorTheLT®3085isa500mAl...
2024-12-12698379.85 KB28页272
IC封装资料_电感_NLV25T-1R5J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12444316.79 KB6页272
IC封装资料_电容_CL10A474KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12503361.46 KB3页272
IC封装资料_电容_0603X226M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217831.05 MB27页272
IC封装资料_电感_NLCV25T-6R8M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121183249.79 KB16页272
IC封装资料_电容_C0805C102K5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-125341.48 MB25页272

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