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IC资料

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IC封装资料_连接器_AFC01-S11H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1217491.58 MB1页267
IC封装资料_三极管_TDM3434.pdf
October15,2015TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®N-ChannelEnhancementModeMOSFETTDM3434DATASHEETDESCRIPTION...
2024-12-12164463.2 KB8页267
IC封装资料_电源管理芯片_TL431AQDBZRVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12109278.43 KB28页267
IC封装资料_电容_CC0402KRX5R7BB225.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219591.22 MB13页267
IC封装资料_电容_CL10C270GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121549316.17 KB3页267
IC封装资料_三极管_WSD4062DN56.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage75VVGSGate-SourceVoltage±25VIDContinuousDrainCurrent,VGS=10V,TC=25°C100AContinuo...
2024-12-121970877.99 KB7页267
IC封装资料_三极管_DMN6075S-7.pdf
DMN6075SDocumentnumber:DS37023Rev.6-21of7www.diodes.comMay2018©DiodesIncorporatedDMN6075SADVANCEINFORMATION60VN-CHANNELENHANCEMEN...
2024-12-1296609.06 KB7页267
IC封装资料_电容_GRM1885C1H470FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12345944.07 KB30页267
IC封装资料_电容_0603CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123701.05 MB27页267
IC封装资料_连接器_1731721.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogGMKDS3/2-7,62OrderNo.:1731721...
2024-12-12549224.35 KB6页267
IC封装资料_连接器_1755639.pdf
https://www.phoenixcontact.com/us/produkte/175563919.10.2012Page1/7Basestrip-MSTBVA2,5/15-G-1755639Pleasebeinformedthatthedatashow...
2024-12-12234203.1 KB7页267
IC封装资料_连接器_1758115.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12110336.13 MB445页267
IC封装资料_电容_CL10Y104MR5NJNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y104MR5NJNCProduct:Multi-layerCeramicCapacitor...
2024-12-12203264.26 KB3页267
IC封装资料_电容_GRM1885C1H112JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121821944.07 KB30页267
IC封装资料_电容_C823D562J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124532.9 MB5页267
IC封装资料_电源管理芯片_LTC3864EDE_PBF.pdf
LTC386413864faFormoreinformationwww.linear.com/LTC3864TypicalapplicaTionFeaTuresDescripTion60VLowIQStep-DownDC/DCControllerwith100...
2024-12-12758771.71 KB30页267
IC封装资料_电感_NLV32T-6R8J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121890224.35 KB10页267
IC封装资料_电容_CL10C820JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C820JC81PNC●Product:Multi-layerCeramicCapacitorCAP,82㎊,100V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1218715.8 MB36页267
IC封装资料_电容_GRM155R61C105KA12D.pdf
GRM155R61C105KA12_(0402,X5R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12392920.85 KB29页267
IC封装资料_电容_0805B562K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219781.26 MB20页267

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