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IC资料

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IC封装资料_电感_YP0403-221M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121145776.45 KB5页266
IC封装资料_电容_GRM188R72A472KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121913944.07 KB30页265
IC封装资料_电容_GRM155R71H182KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12894920.26 KB29页265
IC封装资料_电容_TAJC157K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121054210.32 KB7页265
IC封装资料_电容_CL21C300JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218921.45 MB36页265
IC封装资料_电容_TAJC336K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121580210.32 KB7页265
IC封装资料_连接器_1935297.pdf
https://www.phoenixcontact.com/us/products/193529708/04/2015Page1/6PCBterminalblock-PT1,5/15-5,0-H-1935297Pleasebeinformedthatthed...
2024-12-121378172.23 KB6页265
IC封装资料_电容_CL10C100CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12102340.08 KB3页265
IC封装资料_电源管理芯片_TPS82150SILR.pdf
Load(A)Efficiency(%)50607080901001m10m100m1D017VOUT=1.0VVOUT=1.8VVOUT=2.5VVOUT=3.3VTPS8215012VR1124kR2100kVINPOWERGOODVINENC222µF...
2024-12-12618756.42 KB29页265
IC封装资料_连接器_DF12B_3.5_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121356288.67 KB11页265
IC封装资料_电容_RVT1J101M1010-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126331.08 MB3页265
IC封装资料_连接器_DF12B_3.0_-32DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121706288.67 KB11页265
IC封装资料_三极管_BLM3400.pdf
www.belling.com.cnV2.0Page1BLM3400PbFreeProductN-ChannelEnhancementModePowerMOSFETDESCRIPTIONTheBLM3400usesadvancedtrenchtechnolog...
2024-12-12837169.55 KB4页265
IC封装资料_三极管_BSS123.pdf
SemiconductorGroup1Sep-13-1996BSS123SIPMOS®Small-SignalTransistor•Nchannel•Enhancementmode•LogicLevel•VGS(th)=0.8...2.0VPin1P...
2024-12-12920289.25 KB8页265
IC封装资料_电容_GRM1555C1H5R6BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12381920.26 KB29页265
IC封装资料_电感_YP0502-221M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121285721.52 KB5页265
IC封装资料_三极管_IRFR120ZPBF.pdf
IRFR120ZPbFIRFU120ZPbFHEXFET®PowerMOSFETVDSS=100VRDS(on)=190mΩID=8.7A��www.irf.com1ThisHEXFET®PowerMOSFETutilizes...
2024-12-12963406.87 KB11页265
IC封装资料_电容_CL10C331JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-125441.39 MB36页265
IC封装资料_电容_CL10C301JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121204259.58 KB3页265
IC封装资料_电源管理芯片_LT1376IS8-5_TRPBF.pdf
1LT1375/LT137613756fdAPPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOU1.5A,500kHzStep-DownSwitchingRegulators■Constant500kHzSwitc...
2024-12-121248572.56 KB28页265

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