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IC资料

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IC封装资料_连接器_A2541HWV-37P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12826814.77 KB16页253
IC封装资料_连接器_1803455.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12167036.13 MB445页253
IC封装资料_电容_GRM188D71A106MA73D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121744944.07 KB30页253
IC封装资料_三极管_DMG7430LFG-7.pdf
DMG7430LFGDocumentnumber:DS35497Rev.5-21of7www.diodes.comFebruary2012©DiodesIncorporatedDMG7430LFGADVANCEINFORMATIONPOWERDIisareg...
2024-12-121833304.58 KB7页253
IC封装资料_连接器_AFC01-S58H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1211651.58 MB1页253
IC封装资料_电容_AC0805JRNPO9BN200.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-126851.06 MB24页253
IC封装资料_电容_CL10C101JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121889259.58 KB3页253
IC封装资料_电容_1206B471K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217531.05 MB27页253
IC封装资料_电容_TAJC476K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121398210.32 KB7页253
IC封装资料_连接器_DF12E_4.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121113288.67 KB11页253
IC封装资料_电容_0402B682K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12641.26 MB20页253
IC封装资料_电感_SWPA4030S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126201.32 MB22页253
IC封装资料_电容_GRM155R71E223KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12420920.26 KB29页253
IC封装资料_电源管理芯片_LT1761IS5-BYP_TRPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1210981.21 MB22页253
IC封装资料_电源管理芯片_LM74610QDGKTQ1.pdf
VINQ1DVOUTSGLM74610-Q1VcapGateDriveGatePullDownAnodeVCAPHVCAPLCathodeVoltageRegulatorSourceVbattLM74610-Q1DrainCVcapTVS+VoutTVS-Pr...
2024-12-1215431.38 MB31页253
IC封装资料_电容_0805CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128821.05 MB27页253
IC封装资料_电阻_YC124-JR-0710KL.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158/358TC:122/124/164RoHScompliantProductspecifica...
2024-12-121495868.82 KB12页253
IC封装资料_电容_0603N180J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211791.26 MB20页253
IC封装资料_连接器_1806313.pdf
https://www.phoenixcontact.com/us/products/180631310/27/2014Page1/5Basestrip-GMSTB2,5/11-GF-7,62-1806313Pleasebeinformedthatthedat...
2024-12-121029169.27 KB5页253
IC封装资料_电源管理芯片_LT1964ES5-SD_TRMPBF.pdf
LT196411964fbTYPICALAPPLICATIONDESCRIPTION200mA,LowNoise,LowDropoutNegativeMicropowerRegulatorTheLT®1964isamicropowerlownoise,low...
2024-12-121471310.3 KB16页253

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